Datasheet

This data sheet lists the most popular solders supplied as
flux-cored wire and can be used in addition to the
separate Technical Data Sheets for Multicore cored
solder wire fluxes.
TIN/LEAD ALLOYS
From the following diagram, it can be seen that most
tin/lead solders have a plastic range, i.e. on heating they
are pasty between the solid and liquid states. The solders
are solid at 183°C (361°F).
According to the alloy composition they have different
plastic ranges. 60/40 tin/lead alloy for example becomes
liquid at 188°C (370°F) and therefore has a plastic range
of 5°C (9°F), 40/60 tin/lead has a plastic range of 51°C
(92°F).
PASTY
PASTY
LIQUID
SOLID
Percentage of Tin
Percentage of Lead
100 80 70 60 55 50 40
1006050454030200
°F
452
°C
232
°F
621
527
491
453
435
414
370
361
°C
327
275
255
234
224
212
188
183
For applications such as wave soldering of electronic
assemblies, the requirement for a solder with a relatively
low melting point in conjunction with a short freezing
range leads to the choice of 63/37 or 60/40 Sn/Pb alloy.
Although 63/37 is the eutectic alloy, 60/40 is often used
in practice as the slightly higher 5°C freezing range of
60/40 is of no practical significance and 60/40 is a little
cheaper than 63/37. Under conditions of slow cooling,
60/40 may give duller joints than 63/37 but this is a
purely cosmetic effect.
Lowering the tin content increases the pasty range and
raises the liquidus temperature whilst of course reducing
the cost of the alloy. Wetting properties tend to fall off
with the reduced tin content.
#
Technical Data Sheet
Properties of Alloys
of Multicore

Solder Wires
August 2007
As far as obtaining a low melting point is concerned,
there is no advantage in using a higher tin content than
63/37, since the higher tin content alloys have higher
melting points and cost more.
MULTICORE SAVBIT ALLOY
x SAVES Copper and Iron-plated Soldering
Iron Bits
x SAVES failure of soldered joints as Savbit
prevents erosion of copper wires and copper
plating
x SAVES costs and improves reliability
Multicore Savbit Solder is produced especially to
overcome the problem of ordinary tin/lead solders
dissolving copper. It is an alloy to which a precise
amount of copper has been added so that no further
copper absorption should take place during soldering.
The breakage time of 0.067mm copper wire in various
solders as a function of temperature is shown below.
Savbit 1
HMP
20/80
60/40
Pure Tin
Savbit 1
200 300 400
0.1
1
10
100
1,000
10,000
Time
(seconds)
Temperature (°C)
Savbit solder has been used by leading electronics
manufacturers throughout the world for over forty years.
Savbit was originally used to increase the life of copper
soldering iron bits. Soldering speed and efficiency are
increased by keeping the iron in good condition. Iron-
plated bits having a longer life than plain copper tips are
now commonly used but they also fail eventually
(usually by cracking of the plating) and then erode
rapidly unless Savbit solder is used.
It has also been proved that the use of Savbit alloy can
improve the strength and reliability of soldered joints
very considerably. This is because ordinary tin/lead
alloys can erode thin copper wires (as used for leads of
electronic components) and thin copper films (as used on
NOT FOR PRODUCT SPECIFICATIONS
THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED FOR REFERENCE ONLY. PLEASE CONTACT HENKEL
TECHNOLOGIES TECHNICAL SERVICE FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
PRODUCT.