Datasheet

Technical Data Shee
t
96SC and 97SC Alloy
February 2005
Americas
Henkel Corporation
15350 Barranca Parkway
Irvine,CA 92618
949-789-2500
Europe
Henkel Multicore Solders
Kelsey House, Wood Lane End
Hemel Hempstead
Hertfordshire HP2 4RQ
+44-1442-233233
Asia
Henkel Loctite Hong Kong Ltd.
18/F Island Place Tower
510 King's Road, North Point
Hong Kong
+852.2233.0000
All trademarks, except where noted are the property of Henkel Corp.
Lead Free Solder Alloys for Electronics
PRODUCT DESCRIPTION
MULTICORE
®
96SC and 97SC alloys are designed to be lead
free substitutes for tin/lead alloys in all electronics assembly
soldering operations. Some advantages of MULTICORE
®
96SC and 97SC are:
Best all-around lead-free alternative
Proven in production use for electronics manufacturing
Lowest melting high-tin, lead free alloy without undesirable
additions
Eutectic alloy (no melt range)
Enhanced wetting characteristics
Meets or exceeds QQ-S-571, J-STD-006 and JIS Z 3282
Class A requirements
PROPERTIES OF ALLOYS
Alloy composition:
MULTICORE
®
96SC (SAC387) 95.5%Sn: 3.8%Ag:0.7%Cu
MULTICORE
®
97SC (SAC305) 96.5%Sn: 3.0%Ag:0.5%Cu
Meltpoint:
Eutectic at 217C (423F) for both alloys
Available Forms:
Both alloy are available as either solder paste (no-clean and
water washable) and cored solder wire.
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
Data Ranges
The data contained herein may be reported as a typical value and/or
range (based on the mean value ±2 standard deviations). Values are
based on actual test data and are verified on a periodic basis.
Note
The data contained herein are furnished for information only and are
believed to be reliable. We cannot assume responsibility for the
results obtained by others over whose methods we have no control. It
is the user's responsibility to determine suitability for the user's
purpose of any production methods mentioned herein and to adopt
such precautions as may be advisable for the protection of property
and of persons against any hazards that may be involved in the
handling and use thereof. In light of the foregoing, Henkel Corporation
specifically disclaims all warranties expressed or implied, including
warranties of merchantability or fitness for a particular purpose, arising
from sale or use of Henkel Corporation’s products. Henkel Corporation
specifically disclaims any liability for consequential or incidental
damages of any kind, including lost profits. The discussion herein of
various processes or compositions is not to be interpreted as
representation that they are free from domination of patents owned by
others or as a license under any Henkel Corporation patents which
may cover such processes or compositions. We recommend that each
prospective user test his proposed application before repetitive use,
using this data as a guide. This product may be covered by one or
more United States or foreign patents or patent applications.
NOT FOR PRODUCT SPECIFICATIONS
THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED AS REFERENCE ONLY. PLEASE CONTACT TECHNICAL SERVICE FOR ASSISTANCE AND RECOMMENDATIONS
ON SPECIFICATIONS FOR THIS PRODUCT.

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