Datasheet
Table 28. Boundary Conditions, Performance Targets, and T
CASE
Specifications
Processor PCG
2
Package
TDP
Platform
TDP
Heatsink
3
T
LA
,
Airflow,
RPM,
Ѱ
CA
4
Maximum
T
CASE
Thermal
Profile
5
T
CASE-MAX
@
Platform
TDP
6
Desktop
4C/GT2 95W
1
2013D 84W 84W
Active Cu
Core (DHA-A)
40 °C,
3100 RPM,
0.381 °C/W
y = 0.33 *
Power + 45.0
72.7 °C
4C/GT2 65W
1
2013C
65W 65W
Active Al
Core (DHA-B)
40 °C,
3100 RPM,
0.485 °C/W
y = 0.41 *
Power + 44.7
71.4 °C
2C/GT2 65W
1
54W 54W
Active Al
Core (DHA-B)
40 °C,
3100 RPM,
0.495 °C/W
y = 0.41 *
Power + 44.7
66.8 °C
2C/GT1 65W
1
53W 53W
Active Al
Core (DHA-B)
40 °C,
3100 RPM,
0.495 °C/W
y = 0.41 *
Power + 44.7
66.4 °C
4C/GT2 45W
1
2013B
45W 45W
Active Short
(DHA-D)
45 °C,
3000 RPM,
0.595 °C/W
y = 0.51 *
Power + 48.5
71.5 °C
4C/GT2 35W
1
35W 35W
Active Short
(DHA-D)
45 °C,
3000 RPM,
0.595 °C/W
y = 0.51 *
Power + 48.5
66.4 °C
2C/GT2 35W
1
35W 35W
Active Short
(DHA-D)
45 °C,
3000 RPM,
0.595 °C/W
y = 0.51 *
Power + 48.5
66.4 °C
Notes: 1. TDP shown here, 95W for example, represents the maximum expected platform TDP in the next generation
platform for this type of SKU. This placeholder value is provided as a guideline for hardware design for the next
generation platform.
2. Platform Compatibility Guide (PCG) provides a design target for meeting all planned processor frequency
requirements. For more information, refer to Voltage and Current Specifications on page 99.
3. .N/A
4. These boundary conditions and performance targets are used to generate processor thermal specifications and to
provide guidance for heatsink design. Values are for the heatsink shown in the adjacent column are calculated at
sea level, and are expected to meet the Thermal Profile at TDP. T
LA
is the local ambient temperature of the
heatsink inlet air. Airflow is through the heatsink fins with zero bypass for a passive heatsink. RPM is fan
revolutions per minute for an active heatsink. Ѱ
CA
is the maximum target (mean + 3 sigma) for the thermal
characterization parameter. For more information on the thermal characterization parameter, refer to the processor
Thermal Mechanical Design Guidelines (see Related Documents section).
5. Maximum T
CASE
Thermal Profile is the specification that must be complied to. Any Attempt to operate the processor
outside these operating limits may result in permanent damage to the processor and potentially other system
components.
6. T
CASE-MAX
at Platform TDP is calculated using the maximum T
CASE
Thermal Profile and the platform TDP.
7. ATCA Reference Heatsink supports Socket B and is not tooled for Socket H.
Processor Temperature
A software readable field in the TEMPERATURE_TARGET register contains the
minimum temperature at which the TCC will be activated and PROCHOT# will be
asserted. The TCC activation temperature is calibrated on a part-by-part basis and
normal factory variation may result in the actual TCC activation temperature being
higher than the value listed in the register. TCC activation temperatures may change
based on processor stepping, frequency or manufacturing efficiencies.
5.6
Thermal Management—Processor
Desktop 4th Generation Intel
®
Core
™
Processor Family, Desktop Intel
®
Pentium
®
Processor Family, and Desktop Intel
®
Celeron
®
Processor Family
May 2014 Datasheet – Volume 1 of 2
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