Datasheet

Figure 21. Digital Thermal Sensor (DTS) Thermal Profile Definition
Table 27. Thermal Margin Slope
PCG Die
Configuration
(Native)
Core + GT
TDP (W) TCC Activation
Temperature (°C)
MSR 1A2h 23:16
Temperature
Control Offset
MSR 1A2h 15:8
Thermal
Margin
Slope
(°C / W)
2013D
4+2 (4+2) 84 100 20 0.654
4+0 (4+2) 82 100 20 0.671
2013C
4+2 (4+2) 65 92 6 0.722
2+2 (2+2) 54 100 20 1.031
2+1 (2+2) 53 100 20 1.051
2013B 4+2 (4+2) 45 85 6 0.806
2013A
4+2 (4+2) 35 75 6 0.806
2+2 (4+2) 35 85 6 1.016
2+2 (2+2) 35 85 6 1.021
2+1 (2+2) 35 90 6 1.141
Thermal Specifications
This section provides thermal specifications (Thermal Profile) and design guidelines for
enabled thermal solutions to cool the processor.
Performance Targets
The following table provides boundary conditions and performance targets as guidance
for thermal solution design. Thermal solutions must be able to comply with the
Maximum T
CASE
Thermal Profile.
5.5
Processor—Thermal Management
Desktop 4th Generation Intel
®
Core
™
Processor Family, Desktop Intel
®
Pentium
®
Processor Family, and Desktop Intel
®
Celeron
®
Processor Family
Datasheet – Volume 1 of 2 May 2014
74 Order No.: 328897-006