Datasheet
Ballout and Package Information
170 Intel
®
82845G/82845GL/82845GV GMCH Datasheet
7.2 Package Information
The GMCH is in a 37.5 mm x 37.5 mm FC-BGA package with 1 mm ball pitch. Figure 7-3 and Figure 7-4
show the package dimensions.
Figure 7-3. Intel
®
82845G GMCH Package Dimensions (Top and Side Views)
Units = Millimeters
1.08 ±0.06
Die
0.200
A
Side View
Substrate
0.500 ±0.070
See Detail D
37.50 ±0.050
Top View
37.50 ±0.05
17.9250
16.9500
Detail A
Detail A
Detail B
Detail C
18.75
0.57 ±0.1
0.57 ±0.1
1.5 ±0.05
Detail C
3 x 0.07
Detail D
0.74 ±0.025
0.100 ±0.025
Die Solder
Bumps
Underfill
Epoxy
ϕ
0.6500 ±0.05
ϕ 0.500
Detail A
AC0.203 B
ϕ 1.1500 ±0.05
ϕ 1.00
Detail B
AC0.203 B
18.75 17.9250
16.9500