Datasheet

Electrical Characteristics
148 Intel
®
82845G/82845GL/82845GV GMCH Datasheet
6.3 Power Characteristics
NOTES:
1. See Intel
®
845G/845GL/845GV Chipset: Intel
®
82845G/82845GL/82845GV Graphics and Memory Controller
Hub (GMCH) Thermal and Mechanical Design Guidelines
for more information.
2. These current levels may happen simultaneously and can be summed into one supply.
6.4 Signal Groups
The signal description includes the type of buffer used for the particular signal (see Table 6-4):
AGTL+ Open Drain AGTL+ interface signal. Refer to the AGTL+ I/O Specification
for complete details. The GMCH integrates most AGTL+ termination
resistors.
AGP AGP interface signals. These signals are compatible with AGP 2.0 1.5 V
Signaling Environment DC and AC Specifications. The buffers are not 3.3 V
tolerant. (DVO signals use the same buffers as AGP)
HI CMOS Hub Interface 1.5 V CMOS buffers.
DDR CMOS DDR System memory 2.5 V CMOS buffers.
SDR CMOS SDR System memory 3.3 V CMOS buffers.
Table 6-3. Power Characteristics
Symbol Parameter Max Unit Notes
P
GMCH(DDR)
Thermal Design Power W 1
P
GMCH(SDR)
Thermal Design Power W 1
I
VCC(DDR)
1.5 V Core Supply Current 2.46 A 2
I
VCC(SDR)
1.5 V Core Supply Current 2.0 A 2
I
VCCAGP
1.5 V AGP Supply Current (AGP mode) 0.37 A 2
I
VCCAGP
1.5 V AGP Supply Current (DVO mode) 0.18 A 2
I
VCCHI
1.5 V Hub Interface Supply Current 90 mA 2
I
VTTFSB
GMCH VTT supply Current 2.4 A
I
VCCSM(DDR)
DDR System Memory Interface (2.5 V) Supply Current 2.2 A
I
SUS_2.5
2.5 V Standby Supply Current 95 mA
I
VCCSM(SDR)
SDR System Memory Interface (3.3 V) Supply Current 1.6 A
I
SUS_3.3
3.3 V Standby Supply Current 5 mA
Table 6-4. Signal Groups (Sheet 1 of 2)
Signal
Group
Signal Type Signals
AGP Interface Signal Groups
(a) AGP I/O
GADSTB_[1:0], GADSTB_[1:0]#, GFRAME#, GIRDY#, GTRDY#,
GSTOP#, GDEVSEL#, GAD_[31:0], GC/BE_[3:0]#, GPAR
(b) AGP Input GPIPE#, GSBA_[7:0], GRBF#, GWBF#, GSBSTB, GSBSTB#, GREQ#
(c) AGP Output GST_[2:0], GGNT#
(d) AGP Miscellaneous AGP_VREF, AGP_RCOMP