Computer Hardware User Manual

PrPMC800/800ET Processor PMC Module Installation and Use (PrPMC800A/IH5)
B Thermal Validation
60
The preferred measurement location for a component may be junction, case, or air as specified
in the table. Junction temperature refers to the temperature measured by an on-chip thermal
device. Case temperature refers to the temperature at the top, center surface of the component.
Air temperature refers to the ambient temperature near the component.
Table B-1. Thermally Significant Components
Component
Location
General Description Maximum
Allowable
Temperature
(Degrees C)
Measuremen
t Location
(Junction,
Case or Air)
U2 MPC750, 450MHz
MPC7410, 450MHz
MPC7410 (N), 400MHz
104
104
104
Case
Case
Case
U5 Harrier ASIC 104 Case
U6, U15 Cache SRAM 145 Case
U7-U10, U20-U24 SDRAM 85 Ambient
U1 Clock Chip 85 Ambient
U25, U26 Flash 85 Ambient
U4 Ethernet 85 Case
U3 RS232 Transceiver 85 Ambient
U14 Programmable Logic Device (PLD) 125 Case
U16, U17, U19 SROM 85 Ambient
Q2 2.5V Power Supply 130 Case
Q1 V_PCORE Power Supply 130 Case