Computer Hardware User Manual

B
PrPMC800/800ET Processor PMC Module Installation and Use (PrPMC800A/IH5)
59
B Thermal Validation
Overview
Board component temperatures are affected by ambient temperature, air flow, board electrical
operation, and software operation. In order to evaluate the thermal performance of a circuit
board assembly, it is necessary to test the board under actual operating conditions. These
operating conditions vary depending on system design.
While Motorola performs thermal analysis in a representative system to verify operation within
specified ranges (see Table 0-1 on page 58), you should evaluate the thermal performance of
the board in your application.
This appendix provides systems integrators with information which can be used to conduct
thermal evaluations of the board in their specific system configuration. It identifies thermally
significant components and lists the corresponding maximum allowable component operating
temperatures. It also provides example procedures for component-level temperature
measurements.
Thermally Significant Components
Table B-1 on page 60 summarizes components that exhibit significant temperature rises. These
are the components that should be monitored in order to assess thermal performance. The
table also supplies the component reference designator and the maximum allowable operating
temperature.
You can find components on the board by their reference designators as shown in Figure B-1
and Figure B-2. Versions of the board that are not fully populated may not contain some of these
components.