XR Series System Chassis Reference Guide XRCHASA/IH1
Notice While reasonable efforts have been made to assure the accuracy of this document, Motorola, Inc. assumes no liability resulting from any omissions in this document, or from the use of the information obtained therein. Motorola reserves the right to revise this document and to make changes from time to time in the content hereof without obligation of Motorola to notify any person of such revision or changes.
Preface The XR Series System Reference Guide is written for the person who needs advanced operational information about the XR system. The manual presents a technical discussion of all the major components of the computer system. Motorola® and the Motorola symbol are registered trademarks of Motorola, Inc. PowerPC™ is a trademark of IBM, and is used by Motorola with permission. All other products mentioned in this document are trademarks or registered trademarks of their respective holders.
Safety Summary Safety Depends On You The following general safety precautions must be observed during all phases of operation, service, and repair of this equipment. Failure to comply with these precautions or with specific warnings elsewhere in this manual violates safety standards of design, manufacture, and intended use of the equipment. Motorola, Inc. assumes no liability for the customer's failure to comply with these requirements.
! WARNING This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy, and if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
CE Notice (European Community) Marking a system with the “ “ symbol indicates compliance of that Motorola system to the EMC and Low Voltage directives of the European Community. A system with the CE marking meets or exceeds the following technical standards: EN 55022 “Limits and methods of measurement of radio interference characteristics of information technology equipment.” EN 50082-1 “Electromagnetic compatibility - Generic immunity standard Part 1: Residential, commercial, and light industry.
Contents Chapter 1 Introduction About the XR Series Systems..............................................................................1-1 About this Guide ..................................................................................................1-3 The System Platforms ...................................................................................1-3 Related Documentation.......................................................................................
Chapter 4 SCSI Device Storage Module Overview............................................................................................................... 4-1 Backplanes ...................................................................................................... 4-1 Chassis Options ............................................................................................. 4-1 Power Supply.................................................................................................
Power Requirements............................................................................................5-2 Guidelines for Using Branch Circuits .........................................................5-2 Power Circuit Protection ..............................................................................5-3 Circuit Breakers and Receptacles ................................................................5-4 Electro-Static Discharge ...................................................................
Dual 9-, 12-, and 20-slot Chassis.................................................................. 6-9 Environmental Monitoring............................................................................... 6-12 Assemblies Monitored ................................................................................ 6-12 Temperature Monitoring Function ........................................................... 6-13 Power Supply and Card Cage.............................................................
Cooling Fan.....................................................................................................9-1 Removal....................................................................................................9-1 Replacement.............................................................................................9-2 3 1/2-Inch Drive Module..............................................................................9-3 Removal.................................................................
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FIGURES Figure 2-1. Figure 2-2. Figure 2-3. Figure 2-4. Figure 2-5. Model XR9103 (Front View) ...........................................................2-2 Dual 9-Slot Card Cage (Front View, without bezel) ...................2-4 12-Slot Card Cage (Front View, without bezel) ...........................2-6 20-Slot Card Cage (Front View, without bezel) ...........................2-8 Removing the Front Bezel (Dual 9-, 12-, and 20-Slot Systems)..............................................2-13 Figure 2-6.
Figure 7-3. Figure 8-1. Figure 8-2. Figure 8-3. Figure 8-4. Figure 9-1. Figure 9-2. Figure 9-3. Figure 9-4. Power Supply Locations ...............................................................7-19 Backplane Connectors (Front View) .............................................8-2 9-Slot Backplane Connectors (Front View) ..................................8-8 12-Slot Backplane Connectors (Front View) ...............................8-9 20-Slot Backplane Connectors (Front View) .............................
TABLES Table 2-1. Enclosure Specifications ....................................................................2-9 Table 2-2. Chassis Specifications ......................................................................2-10 Table 3-1. Chassis Specifications ........................................................................3-6 Table 4-1. SCSI Device Storage Module Specifications ...................................4-4 Table 4-2. SCSI Device Storage Module Specifications .................................
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1Introduction 1 About the XR Series Systems The XR Series Systems are based on the VMEbus backplane architecture and the Modular Chassis family of enclosures, power supplies, and SCSI storage subsystems. ❏ Modular Implementation The XR family includes 3-slot, dual 9-slot, 12-slot, and 20-slot systems. Each system is designed as a set of modular building blocks that can be readily adapted and recombined to meet the needs of technical, industrial, and telecommunications applications.
1 Introduction ❏ Ease-of-Maintenance The XR family of systems provides: – Easy access to all major components for removal and replacement. – Front access to VMEmodules, fans, mass storage drives, and power supplies for easy maintenance and reconfiguration – Rear access for cabling and transition module connections – Environmental/power supply monitoring for early detection of developing temperature or power supply problems. – Autojumpering backplane, eliminating manual jumpering of VMEbus signals.
About this Guide About this Guide This guide is directed toward the person who needs advanced system operational information. The guide presents a technical discussion of all the major chassis components of the XR family computer system.
1 Introduction Related Documentation Hardware components are described in the following manuals. If not shipped with this product, they may be purchased by contacting your local Motorola sales office.
Related Documentation Document Title Motorola Publication Number PPC1Bug Diagnostics Manual PPC1DIAA/UM MVME332XT Intelligent Communication Controller User’s Manual MVME332XT MVME332XT Intelligent Communication Controller Support Information SIMVME332XT MVME332XT Serial Intelligent Peripheral Controller Firmware User’s Manual MVME332XTFW MVME376 Ethernet Communications Controller User’s Manual MVME376 MVME710B 8-Channel Serial I/O Distribution Module User’s Manual MVME710B MVME385-120 High Pe
1 Introduction 1-6
2Original XR Chassis 2 Chassis Overview The original style of the XR system chassis is available in the following configurations: ❏ 3-Slot ❏ Dual 9-Slot ❏ 12-Slot ❏ 20-Slot 3-Slot System The Model XR9103 3-slot system (see Figure 2-1 on page 2-2) has a front-loading 3-slot VME card cage with a rear-loading transition card cage. The VME backplane accepts standard 6U 32-bit VME modules from the front, and MVME700 series plug-in transition modules from the rear.
Original XR Chassis 2 11304.00 9601 (1-2) Figure 2-1. Model XR9103 (Front View) Dual 9-slot System The Model XR9209 dual 9-slot system (see Figure 2-2 on page 2-4) is designed for telecom applications requiring dual, independent 9slot VME systems with up to 34GB of disk storage capacity per system. The Model XR9109 is configured with one 9-slot VME system, but it may be upgraded to a dual XR9209 configuration.
Chassis Overview module for industrial and commercial environments. Each system in a Model XR9109 or XR9209 is configured with its own power module. The enclosure contains 10 transition module panels per side for supporting a variety of connectivity and expansion options, such as additional Ethernet, SCSI, and communications interfaces.
Original XR Chassis 2 CPUs INSTALLED MODULAR CARD CAGE ESD BOND POINT SYSTEM B SYSTEM A CABLES CABLES CABLES EXPANSION EXPANSION EXPANSION EXPANSION CPU EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION CPU EXPANSION CABLES FAN DISK DISK FAN FAN DISK DRIVES INSTALLED FAN 11028.00 9407 (2-3) Figure 2-2.
Chassis Overview 12-slot System 2 The Model XR9112 12-slot system (see Figure 2-3 on page 2-6) is designed for telecom applications requiring 12 VME slots and up to 72GB of disk storage capacity. When support for more than five SCSI devices are required, up to eight SCSI Device Storage Modules can be added to the system. Each Storage Module contains up to four half-height drive bays. Two of these bays can contain removable media devices. The system can support up to 37 SCSI drives.
Original XR Chassis 2 CPU INSTALLED MODULAR CARD CAGE ESD BOND POINT CABLES DISK/TAPE DRIVES INSTALLED CABLES EXPANSION EXPANSION EXPANSION EXPANSION Power Supply EXPANSION FAN EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION CPU EXPANSION FAN FAN 11028.00 9407(3-3) Figure 2-3.
Chassis Overview 20-slot System 2 The Model XR9120 20-slot system (see Figure 2-4 on page 2-8) is designed for telecom applications requiring 20 VME slots and up to 100GB of disk storage capacity. A Model XR9120 system typically uses a VME drive module for the initial 3 1/2-inch disk and tape. Additional drives are added using a SCSI Device Storage Module (see Chapter 4). Up to 13 Storage Modules can be added to each system. Each Storage Module contains up to four half-height drive bays.
Original XR Chassis MODULAR CARD CAGE 2 ESD BOND POINT CABLES CABLES EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION 11028.00 9407 (1-3) Power Supply FAN FAN FAN EXPANSION EXPANSION EXPANSION CPU EXPANSION CABLES 2-8 CABLES CPU INSTALLED Figure 2-4.
Chassis Specifications Chassis Specifications 2 The following sections list physical, environmental, and electrical specifications for the base system, the power supplies, and the VMEbus backplane. 3-Slot Chassis Table 2-1. Enclosure Specifications Characteristics Physical characteristics Height Width Depth Weight (fully loaded) Specifications 5.2 in. (132 mm) 19.0 in. (483 mm) w/o flange extensions 23.0 in. (584 mm) with flange extensions 14.0 in. (356 mm) with bezel 25 lb. (11.
Original XR Chassis 2 Dual 9-, 12-, and 20-Slot Chassis Table 2-2. Chassis Specifications Characteristics Physical Dimensions (with front bezel) -- System Chassis Specifications Width: 18.97 in. (481.8 mm) Depth: 13.5 in. (342.9 mm) Height: 20.94 in (531.9 mm) Weight: 60.0 lb. (27.
Chassis Specifications Table 2-2. Chassis Specifications (Continued) Characteristics Safety (Standards for safety of information technology equipment, including electrical business equipment) UL1950 CSA C22.2/950 VDE 0805 IEC 950 Transportation Packaging and shipping containers comply with ASTM 4169 Level 1. and NEBS 4.4.1/4.4.2. Note 2 Specifications Temperature and humidity limits are determined primarily by the type of tape and disk media that you expect to install.
Original XR Chassis 2 Chassis Use Front Bezel Removal The front bezel is a requirement for complete RFI shielding. The bezel is latched on both sides. Screwdriver-operated locks at the upper corners prevent the latches from being arbitrarily disengaged. The latches are to be opened by trained service personnel only.
Chassis Use 2 3 2 1 11049.00 9408 Figure 2-5.
Original XR Chassis 2 11304.00 9601(2-2) FRONT BEZEL Figure 2-6. Removing the Front Bezel (3-Slot System) Front Bezel Replacement 1. (For 9U bezels): Position the ball stud catches at the lower corners of the bezel over the ball studs on the enclosure and press firmly until the catches are fully engaged. 2. Press the sides of the bezel against the enclosure until the latches at the sides snap into place. 3.
Chassis Use Side Panel/Pedestal Cover Removal and Replacement 2 The pedestal configuration incorporates side panels for the various system enclosures (card cage, power supplies, SCSI device storage module, OEM equipment enclosure) and a pedestal cover. The inner surfaces of the panels and cover are molded with slots that engage slide hooks mounted on the enclosure. The side panels are fitted with latching mechanisms. The side panels may be ganged together by means of inner stacking brackets.
Original XR Chassis 2 PEDESTAL TOP COVER MODULAR DRIVE ENCLOSURE (BEZEL REMOVED) PEDESTAL SIDE PANEL MODULAR CARD CAGE BEZEL MODULAR POWER SUPPLY BEZEL BEZEL LOCKS (1 EACH SIDE) Figure 2-7. Pedestal Cover, Bezels, and Side Panels 2-16 11049.
Chassis Use Side Panel Removal 2 The suggested procedure for removing pedestal side panel assemblies is as follows: 1. Remove the front bezel. 2. Unlock the side panel assembly by squeezing the inner latch levers at the forward edge with one hand and simultaneously slide the assembly backward approximately an inch until it clears the slide hooks on the chassis. ! Hand clearance in the latch area is limited. Work carefully to avoid injury to fingers. Caution 3. Lift the assembly off the chassis. 4.
Original XR Chassis 2 11064.00 9409 Figure 2-8.
Chassis Use Side Panel Replacement 2 The suggested procedure for replacing pedestal side panel assemblies is as follows: 1. Engage the slots of the panel assembly with the slide hooks on the enclosure and slide the panel assembly forward until the latch snaps into place. 2. Repeat step 1 at the opposite side of the chassis. 3. Reinstall the front bezel. Pedestal Cover Removal and Replacement The pedestal cover is mounted with the same type of hardware as the side panels, but no latch is used.
Original XR Chassis 2 2-20
3Extended XR Chassis 3 Chassis Overview The Extended Chassis is based on the Original Chassis design. It uses the same backplane, power supplies, and fan trays. The main differences are the dimensions and the bezels. The front VME card cage has been extended outwards approximately 2 inches (approx. 5 cm) to accomodate the Extended Injector/Ejector (VME64) handles on the VMEmodules.
Extended XR Chassis Dual 9-slot System The Model XR9209A dual 9-slot system (see Figure 3-1 on page 3-3) is designed for telecom applications requiring dual, independent 9slot VME systems with up to 34GB of disk storage capacity per system. The Model XR9109A is configured with one 9-slot VME system, but it may be upgraded to a dual XR9209A configuration. 3 A Model XR9109A or XR9209A system typically uses a VME drive module for the initial 3 1/2-inch disk and tape.
Chassis Overview CPUs INSTALLED MODULAR CARD CAGE 3 ESD BOND POINT SYSTEM B SYSTEM A CABLES CABLES CABLES EXPANSION EXPANSION EXPANSION EXPANSION CPU EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION CPU EXPANSION CABLES FAN DISK DISK FAN FAN Power Supplies DISK DRIVES INSTALLED FAN 11028.00 9407 (2-3) Figure 3-1.
Extended XR Chassis 20-slot System The Model XR9120A 20-slot system (see Figure 3-2 on page 3-5) is designed for telecom applications requiring 20 VME slots and up to 100GB of disk storage capacity. 3 A Model XR9120A system typically uses a VME drive module for the initial 3 1/2-inch disk and tape. Additional drives are added using a SCSI Device Storage Module (see Chapter 4). Up to 13 Storage Modules can be added to each system. Each Storage Module contains up to four half-height drive bays.
Chassis Overview ESD BOND POINT MODULAR CARD CAGE 3 CABLES CABLES CPU INSTALLED CABLES EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION CPU EXPANSION CABLES 11028.00 9407 (1-3) Power Supply FAN FAN FAN Figure 3-2.
Extended XR Chassis Chassis Specifications Table 3-1. Chassis Specifications 3 Characteristics Physical Dimensions (with front bezel) -- System Chassis Specifications Width: 18.96 in. (481.58 mm) Depth: 13.16 in. (334.19 mm) Height: 20.94 in (531.95 mm) Weight: 60.0 lb. (27.
Chassis Specifications Table 3-1. Chassis Specifications (Continued) Characteristics Specifications Safety (Standards for safety of information technology equipment, including electrical business equipment) UL1950 CSA C22.2/950 VDE 0805 IEC 950 Transportation Packaging and shipping containers comply with ASTM 4169 Level 1. and NEBS 4.4.1/4.4.2.
Extended XR Chassis Chassis Use 3 Note You will need a 4mm Allen wrench to perform these procedures. Front Bezel Removal The front bezel is a requirement for complete RFI shielding. Allen wrench-operated locks at the upper corners fasten the bezel in place. The bezels are to be removed by trained service personnel only.
Chassis Use 3 2119 9711 Figure 3-3.
Extended XR Chassis 3 2121 9711 Figure 3-4.
Chassis Use Front Bezel Replacement 1. (For 9U bezels): Slide the guide catches at the lower corners of the bezel over the guides on the enclosure and seat the bezel firmly. 2. Press the sides of the bezel against the enclosure until the bezel is flush with the enclosure. 3. Lock the bezel by rotating the locks a quarter-turn outward from the “unlocked” position to the “locked” position with a 4mm Allen wrench.
Extended XR Chassis 3 3-12
4SCSI Device Storage Module 4 This chapter provides a brief overview of the SCSI Device Storage module. For more information about this device, please refer to the XR900 Series Mass Storage Subsystem User’s Manual (available through your local Motorola sales representative). Overview The SCSI Device Storage Module has room for up to four SCSI devices. It contains four half-height peripheral bays.
SCSI Device Storage Module Power Supply The power is supplied to the SCSI Device Storage Module in one of three ways: 4 ❏ System Power ❏ AC Power Supply Module ❏ DC Power Supply Module System power is provided through an optional connector on the bottom of the storage module (see Figure 4-4 on page 4-14). It plugs into a receiver on the top of the XR system, and power is supplied directly from the system’s backplane.
Overview Environmental Monitoring The SCSI Device Storage Module is equipped with an environmental monitoring function. This functions monitors the internal temperature of the module. Two overtemperature levels are used by this function: 4 ❏ When the first overtemperature level is reached, an Overtemperature LED (located next to the SCSI connectors on the back panel of the module) turns on.
SCSI Device Storage Module Specifications The following tables provide the specifications for the various components of the SCSI Device Storage Module. 4 Original Chassis Table 4-1. SCSI Device Storage Module Specifications Characteristics Specifications Physical Characteristics: 5.25 in. (133 mm) Height Width 19.0 in. (483 mm) w/o flange extensions 23.0 in. (584 mm) with flange extensions Depth 13.5 in. (343 mm) with bezel Weight (fully loaded) 25 lb. (11.
Specifications Extended Chassis Table 4-2. SCSI Device Storage Module Specifications Characteristics Specifications Physical Characteristics: Height 5.25 in. (133 mm) Width 19.0 in. (483 mm) w/o flange extensions 23.0 in. (584 mm) with flange extensions Depth 13.5 in. (343 mm) with bezel Weight (fully loaded) 25 lb. (11.
SCSI Device Storage Module Power Supply Table 4-3. Power Supply Specifications Characteristics Physical Characteristics: Height Width Length Temperature: Operating Storage and transit Relative humidity Altitude: Operating Storage and transit Power Ratings: Input voltage (DC) Input voltage (AC) 4 4-6 Specifications 4.0 in. (102 mm) 2.4 in. (61 mm) 9.0 in.
Specifications Backplane The following table provides the specifications for both the singleended and the differential SCSI backplane options. Table 4-4. SCSI Backplane Specifications Characteristics Physical Characteristics: Height Width Thickness Temperature: Operating Storage and transit Relative Humidity Power Consumption (without drive modules) SCSI Sockets 4 Specifications 4.1 inches (104mm) 11.6 inches (295mm) 0.062 inches (1.
SCSI Device Storage Module SCSI Device Storage Module Procedures Notes The Rack/Mast and Pedestal mounting procedures are the same as those for the 3-slot chassis. Refer to Chapter 5: Site Preparation and Installation for this information. 4 The Pedestal Cover and Side Panel installation procedures are the same as those for the 3-slot chassis. Refer to Chapter 2: Original XR Chassis for this information.
SCSI Device Storage Module Procedures LATCH BUTTONS (1 EACH SIDE) 4 11051.00 9408 Figure 4-1.
SCSI Device Storage Module Front Bezel Removal and Replacement (Extended Chassis) The bezel is required for complete RFI shielding. Note 4 You need a 4mm Allen wrench to complete these procedures. Removal Refer to figure Figure 4-2 on page 4-11 while performing this procedure. 1. Unlock the bezel by rotating the locks a quarter-turn inward from the “locked” position to the “unlocked” position with a 4mm Allen wrench (clockwise on the left side, counterclockwise on the right). 2.
SCSI Device Storage Module Procedures 4 2118 9711 Figure 4-2. SCSI Device Storage Module Front Bezel Removal Removable Media Access Plate Removal If you have removable media in one or both of the 5 1/4-inch drive bays, you should remove the access plate from the bezel to give you access to your media without having to remove the bezel each time. 1. Remove the bezel from the SCSI Device Storage Module. 2.
SCSI Device Storage Module Removable Media Access Plate Replacement After removing a removable media drive, or replacing it with a hard drive, it is necessary to replace the removable media access plate. 1. Remove the front bezel from the SCSI Device Storage Module. 4 2. Slide the removable media access from the back side of the bezel into the opening (see Figure 4-3). Align the screw holes with those on the bezel. 3. Tighten the four screws with a Phillips-head screwdriver. 4. Replace the front bezel.
SCSI Device Storage Module Procedures SCSI Device Storage Module Removal and Replacement The SCSI Device Storage Module, if present, is mounted on guide pins directly atop the chassis. It receives power from the VME card cage through a connector at the top of the chassis. SCSI signals pass through an external cable at the back of the system. 4 Module Removal 1.
SCSI Device Storage Module EXPANSION CHASSIS 4 CARD CAGE 11050.00 9408 Figure 4-4. Removing SCSI Device Storage Module (System Powered) Module Replacement 1. Ensure that all chassis power is set to STANDBY and the chassis is disconnected from the AC or DC power source.
SCSI Device Storage Module Procedures 2. Using the guide pins on the bottom of the peripheral expansion chassis for alignment, lower the expansion chassis onto the VME card cage. 3. Reinstall the four screws removed in step 6, above, at the inside corners of the expansion chassis. 4. Reinstall the top cover on the expansion chassis with the five screws provided. 5.
SCSI Device Storage Module SCSI Drive Removal and Replacement The SCSI peripheral storage enclosure contains up to four halfheight storage devices. Two bays accommodate 3 1/2-inch devices only. The other two bays accommodate either 3 1/2-inch devices, when mounted in carrier adapters, or 5 1/4-inch devices. 4 The suggested procedure for removal and replacement of 3 1/2inch or 5 1/4-inch drive modules is described next. Drive Removal 1.
SCSI Device Storage Module Procedures 5. Reinstall the front bezel, if the installation includes one. 6. Reconnect the system to the AC or DC power source. 4 Figure 4-5.
SCSI Device Storage Module Power Supply Removal and Replacement The power supply module (Figure 4-6 on page 4-19) is installed at the right side of the drive bays in the module’s chassis. The power supply receives –48Vdc or 115/230Vac input power directly through its back panel. The power supply outputs are cabled to the cooling fan and to a backplane connector, which applies operating voltages from the power supply to the mass storage modules.
SCSI Device Storage Module Procedures 5. Slide the module out. 4 11276.00 9503 (1-2) Figure 4-6. Power Supply Removal Replacement 1. Slide the power supply module carefully into the chassis. Use firm steady pressure to seat the connector properly. 2. Tighten the captive screw that holds the module in the chassis. 3. Reinstall the module’s bezel, if the installation includes one. 4.
SCSI Device Storage Module Cooling Fan Removal and Replacement The DC-powered fan mounted on the power supply module provides forced-air cooling for the power supply and the mass storage drives. The suggested procedure for removal and replacement of the cooling fan is as follows: 4 Removal 1. Remove the power supply module as described in the previous section. 2. Using a flat-tipped screwdriver, remove the three screws that secure the fan and finger guard to the power supply assembly. 3.
5Site Preparation and Installation 5 Setting up the proper working environment for computer equipment can greatly increase its reliability and utility. This next section provides guidelines for site preparation before installation of the computer. Placement Recommendations To ensure that the computer runs at its maximum efficiency, it is important that it is positioned correctly.
Site Preparation and Installation Weight Distribution To avoid hazards arising from uneven mechanical loading of the rack, plan the installation so that (within the limitations of equipment and cabling) the weight of the equipment is evenly distributed across the width of the rack. The heaviest units should be located towards the bottom. 5 Power Requirements The computer system should be connected to branch circuits specifically and totally dedicated for the computer system.
Power Requirements Laser printers and some other devices cause periodic short duration heavy loads that are not reflected in their ampere ratings. Connect laser printers on a separate branch circuit from the computer enclosure. Using power strips with separate circuit breakers does not add additional protection and may cause unwanted power interruption. Ensure that all power strips or extension cords used are not too long and are at least #16 (the best choice is #14 AWG or larger) with ground.
Site Preparation and Installation A second type of UPS is called a “standby” UPS, or SPS. This device switches to a battery system if power fails. SPS units usually lack protective circuitry and power conditioning capability; as a result, they are more susceptible to input power fluctuations than nobreak/online UPS units. If you opt for an SPS, be sure to get one that has a switchover time of 5 milliseconds or less.
Power Requirements The system is designed to operate in an area with 10% to 80% noncondensing relative humidity. A dry area (below 20% relative humidity) is conducive to ESD problems.
Site Preparation and Installation Installation Options A system can be either rack-mounted or set up in a floor-standing pedestal configuration (dual 9-, 12-, and 20-slot, Original Chassis style only). The pedestal configuration requires base and crown components as well as bezels and side panels. The chassis components interconnect vertically with a latching mechanism. 5 Pedestal Installation The pedestal configuration requires base and cap components as well as bezels and side panels.
Installation Options PEDESTAL TOP COVER PEDESTAL SIDE PANEL MODULAR DRIVE ENCLOSURE 5 9U MODULAR CHASSIS MODULAR POWER SUPPLY 11034.00 9407 PEDESTAL BASE WITH REMOVABLE WINGS Figure 5-1.
Site Preparation and Installation Rack System Installation The rack system can be installed in any standard 19-inch or 23-inch rack. The advantage of a rack system is better utilization of floor space. Figure 5-4 on page 5-12 shows a representative front view of the system in a rack configuration The system can be installed without modification in a standard 19inch RETMA (or equivalent) equipment rack.
Installation Options OPTIONAL CENTER LOCATION FOR MOUNTING FLANGES 5 11304.00 9601 (3-1) Figure 5-2.
Site Preparation and Installation FOR 19-INCH INSTALLATIONS 5 OPTIONAL CENTER LOCATION FOR MOUNTING FLANGES 11029.00 9407 FOR 23-INCH INSTALLATIONS Figure 5-3.
Installation Options The next two steps are a two-person operation. It may be desirable to remove the power supply module beforehand to make the chassis as light as possible. 5. Position the chassis in the selected rack bay or mast location and align the slots in the chassis flanges with the corresponding holes in the frame rails of the rack or mast. 6. Install screws at those locations to secure the chassis in position. 5 7. Reinstall the front bezel.
Site Preparation and Installation 3U FILLER PANELS 5 3U MODULAR DRIVE ENCLOSURE 9U MODULAR CARD CAGE 3U MODULAR POWER SUPPLY 11035.00 9407 Figure 5-4.
Cabling Cabling After you have completed the rack installation or otherwise situated the system and associated equipment, proceed as follows to cable the hardware together. Note All rack cabling should be contained within the rack bay. Cabling to external peripheral equipment should be routed through the rear panel of the rack. 5 Cables The system console, printers, and some other peripherals use EIA-232-D cables.
Site Preparation and Installation ❏ Provision for up to 100 transceivers (depending on cable length), via annular rings spaced at intervals of 2.5 m (approximately eight feet) along the cable. ❏ Termination at both ends by N-series 50-ohm terminators. The network must have a single ground connection. The thinnet type of Ethernet cable has the following characteristics: 5 ❏ A maximum length of 167 m (547 feet) ❏ Provision for up to 30 transceivers, regardless of cable length.
Cabling ❏ Do not lay signal cables outside buildings without protection from lightning and weather. ❏ Use the shortest possible cable between the processor unit and peripherals. ❏ To ensure that maximum protection for the equipment and operators is achieved, check the protective grounds at each power outlet for adequacy.
Site Preparation and Installation 5 ❏ Firmly secure all interface cable connectors by tightening all associated hardware. ❏ Install and lock the front bezel as described in the Front Bezel Removal and Replacement section of Chapter 2. ❏ Do not install or attach any additional cables to the front facing circuit cards. 3-Slot Chassis Cabling Data/Control Cables (without Alarm Board) Refer to Figure 5-5 on page 5-17 while following these procedures. 1.
Cabling 5 ENVIRONMENTAL MONITOR CABLE SCSI CABLE 11408.00 9602 Figure 5-5.
Site Preparation and Installation Data/Control Cables (with Alarm Board) Refer to Figure 5-6 on page 5-19 while following these procedures. 1. Plug the end of an EIA-232-D cable into the host port of the terminal to be used as the system console. 2. Plug the other end of the cable into the transition module connector marked CONSOLE or SERIAL PORT 1 on the back of the system. 5 3.
Cabling 5 ENVIRONMENTAL MONITOR CABLES SCSI CABLES 2071 9706 Figure 5-6.
Site Preparation and Installation Environmental Monitor Cables Depending on whether your installation includes a SCSI Device Storage Module and/or an optional alarm board, install the RJ45 cabling for the Environmental Monitor circuitry as described in the following table. Table 5-1. Environmental Monitor Cabling 5 SCSI Enclosure Present? Alarm Board Install RJ45 Cables as Follows Present? Yes Yes System power supply to SCSI enclosure. SCSI enclosure to alarm board.
Cabling 2. Guide the free end of a DC power cable, with about 1/2 inch of insulation stripped from the wires, to the terminal block supplied with the DC system. Clamp the DC leads (positive, negative, and ground) to the terminal block. ! Caution The connection to DC power consists of three wire leads (no larger than #12 AWG, fine strand or solid, but capable of handling at least 10 Amps of current). To avoid grounds or shorts, exercise care when securing the wires to the connector.
Site Preparation and Installation 4. Plug the assembled connector into the DC power inlet located on the back panel of the system. 5. If there is other equipment requiring DC power, cable those devices to the DC source as described in the associated installation guides. 6. For AC equipment such as the system console, plug the socket end of the unit's power cord into the AC power inlet on the back of the unit. 5 7.
Cabling Dual 9-, 12-, and 20-Slot Chassis Cabling Control Cables (12- and 20-Slot Systems without Alarm Board) Use the following instructions to install the control cables. 1. Plug the end of an EIA-232-D cable into the host port of the terminal to be used as the system console. 2. Plug the other end of the cable into the transition module connector marked CONSOLE or SERIAL PORT 1 on the back of the system. 3.
Site Preparation and Installation 5 11063.00 9409 Figure 5-7.
Cabling Control Cables (12- and 20-Slot Systems with Alarm Board) Refer to Figure 5-8 on page 5-26 while following these instructions. 1. If the chassis is equipped with a SCSI Device Storage Module, connect an RJ-45 cable between the SCSI ENV port on the Alarm Board and the storage module’s RJ-45 connector (identified by a “no telephone” graphic). 2. Plug one end of an an RJ-45 cable into the VME ENV port on the Alarm Board. 3.
Site Preparation and Installation 5 2070 9706 Figure 5-8.
Cabling Control Cables (Dual 9-Slot System without Alarm Board) Use the following instructions to install the control cables. 1. Plug the end of an EIA-232-D cable into the host port of the terminal to be used as the system console for System A. 2. Plug the other end of the cable into the transition module connector marked CONSOLE or SERIAL PORT 1 on the back of the system on the System A side. 3.
Site Preparation and Installation Control Cables (Dual 9-Slot System with Alarm Board) Refer to Figure 5-9 on page 5-29 while following these preocedures. 1. If the chassis is equipped with a SCSI Device Storage Module, connect an RJ-45 cable between the SCSI ENV port on the Alarm Board and the storage module’s RJ-45 connector (identified by a “no telephone” graphic). 2. Plug one end of an an RJ-45 cable into the VME ENV port on the Alarm Board. 5 3.
Cabling SYST EM B SYST 5 EM A 2076 9707 Figure 5-9. Dual 9-Slot Chassis Control Cables (with Alarm Board) Power Cables (AC Chassis) Use the following instructions to install the power cables. 1. Plug the female end of the system’s power cord into the AC power connector located on the lower back panel. 2. Plug the end of the console terminal’s power cord into the connector on the back of the terminal. 3. Attach power cords to all other associated equipment.
Site Preparation and Installation 4. Plug the power cords into appropriate electrical outlets (if any of the equipment is rack-mounted, the rack may be equipped with power distribution modules). Power Cables (DC Chassis) 5 ! Caution Connect the equipment to a -48 Vdc supply source that is electrically isolated from the DC source. The -48 Vdc source is to be reliably connected to earth. 1. Remove the power to the -48Vdc wires to be connected to the system. 2.
Cabling GROUND 48V +|Insert Wires Here Clamping Screws 5 Figure 5-10. DC Terminal Block Note For additional protection if the conditions of the site call for it, you may wish to also use the chassis ground point on the rear wall of the unit (the GND connection with a 1/4 x 20 thread located to the upper left of the ESD bond point). This ground point is to be connected to the equipment rack or other reliable path to earth ground. 4.
Site Preparation and Installation 5 5-32
6Chassis Operations 6 This chapter describes the controls, indicators, and operating procedures for the system chassis. Only those controls and indicators that are part of the base system (i.e. the chassis) are described here; many of the individual VMEmodules used in the system are equipped with their own controls and indicators. For information about the controls and indicators on the individual VMEmodules, refer to the user’s manual for that module (see Related Documentation in Chapter 1).
Chassis Operations Table 6-2. Dual 9-, 12-, and 20-Slot System Controls and Indicators 6 Control Location Function Three-position key switch Front of enclosure, Provides a convenient means of turning the upper left or right system power off (STANDBY) and on (RUN), or of resetting the unit in the event of a malfunction (RESET). Removing the key locks the associated system in its current state, either on or off.
Controls and Indicators The Reset (▲) position supplies a SYSRESET signal to the backplane to reset the system in the event of a malfunction. Reset (▲) is a momentary-contact setting that is available only when the key is inserted in the switch. 3-Slot Indicators Indicators to display the status of input power, operating voltages, and interior temperatures are located on the front panel of the power supply module. ❏ The Input Power LED ( ) indicates the presence of input power to the power supply.
Chassis Operations chassis backplane, which distributes power to the fans, mass storage drives, and VME card cage. ❏ The input power LED (on the front of the power supply -visible with the power supply bezel removed) indicates the presence of -48Vdc or 115/230Vac input power (depending on the type of power supply installed) at the power supply inputs.
Power On/Off Procedures the the limits documented in the IEE Standard for a Versitile Backplane Bus: VME Bus. The maximum current loads per pin for transition modules is the same as for VME modules. Note that thermal considerations are also necessary when integrating high power modules. The individual thermal profile of modules requires the integrator to understand the particular requirements of the modules and to test where there is any question.
Chassis Operations 2. On the system, verify that the power switch is set to the position (Standby, or “off”). Note If the power switch is set to the | position (“on”) when the line cord is connected to a power source, the outputs of the associated power supply cycle on immediately. 3. Verify that the system is connected to the Vac or Vdc input power source (as appropriate to the installation and system configuration).
Chassis Cooling Recommended Power-Off Procedure Note Ensure that proper software shutdown procedures have been followed before you continue. 1. Insert the key and turn the power switch to the position (Standby, or “off”). The power supply cycles down, but the power status LED on the power supply remains on, indicating that primary power is still present. 2. If the system incorporates a dual 9-slot chassis, repeat step 1 for System B. 3.
Chassis Operations the VMEmodules and the drives in the VME card cage. Cooling air is drawn in at the front of the fan module, forced past the VMEmodules, drives, and power supply, and vented through the right rear panel of the chassis. The internal fan provides airflow sufficient for most installations, but some high-density, high-power VMEmodules may require additional cooling. When integrating VMEmodules that are known to run hot, testing is advisable to confirm that these modules are properly cooled.
Chassis Cooling Dual 9-, 12-, and 20-slot Chassis The VME card cage is cooled by a front plug-in fan module providing front to rear airflow. Dual fan modules are available for the dual 9-slot configuration. The individual fan modules are replaceable without interrupting power to the companion system. The system is designed for an input air temperature below 50° C (122° F).
Chassis Operations Airflow (in) Airflow (out) Plug-in Drives Drive Enclosure VME Card Cage Transition Optional External 68-pin mini to 68-pin mini SCSI Cable 6 DC Power Connection Airflow (in) Airflow (out) Power Supply Plug-in Power Supply Airflow (in) Base Figure 6-1.
Chassis Cooling The system is designed for use in a relatively clean (office or lab) environment. To assure reliable operation in an industrial environment, you may need to provide protection against airborne particles and other contaminants, especially for the disk or tape drives and their associated media. The internal fans provide airflow sufficient for most installations, but some high-density, high-power VMEmodules may require additional cooling.
Chassis Operations Environmental Monitoring An environmental monitoring function to track enclosure temperatures and operating voltages is incorporated into the chassis design. The environmental monitor provides: ❏ Overtemperature Reporting -- the temperature in the chassis, power supply, or optional SCSI Device Storage Module exceeds maximum safe termperature (without regard to which one of the actual sensors causes the activation).
Environmental Monitoring Temperature Monitoring Function The overtemperature LED on the front panel of the system indicates the presence of excessive operating temperatures within one or more of the following subassemblies: ❏ The power supply ❏ The card cage ❏ The standalone SCSI peripheral expansion enclosure (if installed) The SCSI enclosure also drives an overtemperature LED of its own on the back panel. Power Supply and Card Cage Two temperature thresholds exist in a system power supply.
Chassis Operations Several conditions can trigger the alarm: ❏ A failed fan in a warm environment ❏ Blocked airflow in or out of the enclosure ❏ An ambient temperature near the specified limits of the enclosure (50˚ C/122˚ F) The overtemperature LED turns off when the cooling problem is corrected if the correction is made before the power supply sensor warms another 5˚ F to system shutdown.
Environmental Monitoring Overtemperature Warning LED The system thermal warning LED, designated with a thermometer symbol, can be activated by: ❏ The power supply’s first threshold ❏ High temperature alert from the SCSI peripheral expansion enclosure. If disk subsystem is present, signal is available through the cable from the enclosure’s RJ-45 connector to the back of control board.
Chassis Operations 6 6-16
7Power Supplies 7 3-Slot Power Supply DC power for the backplane, fan, and drives is furnished by a UL/CSA/VDE-approved 170W autoranging power supply module. Power supply modules are available in both –24/–48Vdcand 115/230Vac-compatible versions, each providing +5Vdc, +12Vdc, and –12Vdc to the system (with power factor correction in the AC version). The power supply module is installed next to the VMEmodule card cage.
Power Supplies The power supply is mounted in a module next to the card cage. If the power supply fails, the module is replaced as a unit. The power supply receives –24/–48Vdc or 115/230Vac input power directly through the back panel of the system. The power supply plugs into a backplane connector, which applies operating voltages from the power supply to the VME card cage, the cooling fan, and (if installed) the drive modules.
3-Slot Power Supply 11315.00 9505 7 Replacement 1. Slide the power supply module carefully into the chassis. Use firm steady pressure to seat the connector properly. 2. Tighten the captive screw that holds the module in the chassis. 3. Reinstall the front bezel. 4. Reconnect the system to the AC or DC power source: – If the power supply is an AC unit, plug the power cord back into the AC outlet.
Power Supplies Dual 9-, 12-, and 20-Slot Power Supply DC power for the backplane, fans, and drives is furnished by a UL/CSA/VDE-approved 700W autoranging power supply module. Both -48Vdc- and 115/230Vac-compatible versions are available, each providing +5 Vdc, +12 Vdc, and -12 Vdc to the system (with power factor correction in the AC version). The power supply modules are installed below the VMEmodule card cage.
Dual 9-, 12-, and 20-Slot Power Supply All specifications are applicable under any specified combination of input, output, and environmental conditions. All measurements are with respect to terminals on the power supply. The following tables, Table 7-3 and Table 7-4, provide more detailed information about the power supplies. Table 7-3.
Power Supplies Table 7-3. 700 Watt AC Power Supply Specifications (Continued) 7 Fast Transient Test The following power Fast transient pulse parameters, per EN55101-4 does not adversely affect the power supply’s operation. Voltage, -/+ 4000 V tBurst, 15 msec fBurst, 2.5 KHz tRep, 300 ms Injection, Asynchronous, Coupling, On L1, L2 and E Duration, 1 minute Output Power 700 watts total continuous from all outputs.
Dual 9-, 12-, and 20-Slot Power Supply Table 7-3. 700 Watt AC Power Supply Specifications (Continued) AC/DC Power Supply Operation When one each of an AC input and a DC input supply are installed together, they operate with the following characteristics. 1). When adding the second power supply to the system, AC or DC, it can be plugged into a backplane of a running system before the input power cord is attached and not cause the running power supply to fault. 2).
Power Supplies Table 7-3. 700 Watt AC Power Supply Specifications (Continued) 7 +5 Volt Risetime The +5 volt output transitions from +2 volts to +4.75 Volts in less than 20 mS. The +5 volt output has a monotonic rise time. The maximum allowable overshoot is 2%. The above conditions is over the complete load range from minimum to maximum load, with a capacitive load from zero (0) to 2000 ufd. The above conditions are over the complete input range of the power supply.
Dual 9-, 12-, and 20-Slot Power Supply Table 7-4. 700 Watt DC Power Supply Specifications DC Voltage: Isolation Voltage: Leakage Current: Power Factor: Surges: Surge Withstand Capability Test Surge Voltages in Low-Voltage AC Power Circuits Test Fast Transient Test 36 Vdc to 72 Vdc 1500 Vac or DC equivalent minimum input to frame or as required by IEC specification Not to exceed 3.0 mA @ 250 Vac 60 Hz Minimum 0.98 with full load and nominal line. Withstands surges of 20% for 1/2 cycle at nominal line.
Power Supplies Table 7-4. 700 Watt DC Power Supply Specifications (Continued) 7 Output Power 700 watts total continuous from all outputs. 850 watts, 30 seconds peak for 300 mS at 10% maximum duty cycle Output Isolation There is a common +5, -12 and +12 volt return. Output Noise Total periodic and random deviation (PARD) noise found on the outputs of the power supply is a maximum of 100 mV P-P, or 1.
Dual 9-, 12-, and 20-Slot Power Supply Table 7-4. 700 Watt DC Power Supply Specifications (Continued) 2). When one of each of an AC input and a DC input supply are installed in a system, and each has appropriate input power and is enabled, the AC input supply operates and provides 100 percent of the output load, and the DC input supply is in standby mode, providing no output power. 3).
Power Supplies Table 7-4. 700 Watt DC Power Supply Specifications (Continued) 7 Power Supply Enable The power supply enable is a system controlled signal that allows the supply to output DC power. The signal sense is LOW = no output, HIGH = DC output. This signal line from the power supply may float up to 15 volts when not connected. This line does not output more than 10 ma when externally connected to ground. The power supply must remain off if this signal is less than 0.6 volts.
Dual 9-, 12-, and 20-Slot Power Supply Removal and Replacement The flexibility of the XR system allows a variety of power supply configurations. Use the following list to determine the best installation method for your system’s configuration. ❏ To replace the power supply in a dual 9-slot system or in a system configured with a single power supply, follow the instructions in Dual 9-Slot/Single Power Supply Replacement on page 7-13.
Power Supplies GROUND 48V +|- Clamping Contact Screws 3. Remove the power supply bezel. 4. Loosen the two yellow, captive screws in the upper corners of the power supply (see Figure 7-1 or Figure 7-2 on page 7-18). 5. Slide the power supply straight out of the chassis (see Figure 7-3 on page 7-19). 7 6. Slide the replacement power supply carefully into the chassis. Use a firm, steady pressure to seat the connectors properly. 7.
Dual 9-, 12-, and 20-Slot Power Supply – If the power supply is an AC unit, unplug the power cord from the AC outlet and from the back of the XR chassis. – If the power supply is a DC unit, turn off the -48Vdc power source and unscrew the clamping contacts to release the DC leads from the terminal block on the power supply. GROUND 48V +|- Clamping Contact Screws 3. Remove the power supply bezel. 7 4.
Power Supplies 7. When the LED goes out, use a firm, steady pressure to seat the power supply properly. ! Caution If the power supply does not seat smoothly, use a gentle rocking motion to seat it. DO NOT back the unit out. If you do back the unit out, restart this procedure from step 6 to avoid resetting the system. 8. Tighten the two yellow, captive screws in the upper corners of the power supply. 9. Reinstall the power supply bezel. 10.
Dual 9-, 12-, and 20-Slot Power Supply 3. When the LED goes out, use a firm, steady pressure to seat the power supply properly. ! Caution If the power supply does not seat smoothly, use a gentle rocking motion to seat it. DO NOT back the unit out. If you do back the unit out, restart this procedure from step 2 to avoid resetting the system. 4. Tighten the two yellow, captive screws in the upper corners of the power supply (see Figure 7-1 on page 7-18). 5. Reinstall the power supply bezel. 6.
Power Supplies Captive Screws Hot Swap CHARGING HOT SWAP LED POWER GOOD 2091 9708 7 Figure 7-1. MC1000K-AC700A / MC1000K-DC700A (New) Front Panel Captive Screws Input Power Indicator 2090 9708 Figure 7-2.
Dual 9-, 12-, and 20-Slot Power Supply EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION CPU Modular Card Cage GND EXPANSION CABLES EXPANSION EXPANSION CPU SYSTEM B SYSTEM A EXPANSION EXPANSION EXPANSION EXPANSION CPU EXPANSION CABLES EXPANSION EXPANSION EXPANSION EXPANSION CPU EXPANSION CABLES DISK DISK FAN FAN FAN FAN EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION
Power Supplies 7 7-20
8VMEbus Backplane 8 This chapter provides information about the VME backplane installed in the system. The backplane performs these two functions ❏ Interconnects VMEmodules and transition modules ❏ Distributes operating voltages from the power supply modules to the cooling fans and (if installed) mass storage modules Description 3-Slot Backplane The backplane (see Figure 8-1 on page 8-2)is fully assembled with connectors and terminators.
VMEbus Backplane 1 9 10 18 J1 POWER SUPPLY P1/2 P1/3 P2/1 P2/2 P2/3 SP1 P1/1 SP2 8 J2 FAN 1 9 10 18 Figure 8-1. Backplane Connectors (Front View) 8-2 11380.
Description VMEbus Interface Signals The signals and pin assignments for VMEbus connectors J1/P1 and J2/P2 are listed in Table 8-1 on page 8-4 and Table 8-2 on page 8-5. The signals and pin assignments for the “XP” VMEbus connectors (the transition module connectors) are listed in Table 8-3 on page 8-6.
VMEbus Backplane Table 8-1.
Description Table 8-2.
VMEbus Backplane Table 8-3.
Description Dual 9-, 12-, and 20-Slot Backplane The system chassis contains a 20-slot (see Figure 8-2 on page 8-8), 12-slot (see Figure 8-3 on page 8-9), or dual 9-slot (see Figure 8-4 on page 8-10) full 32-bit VMEbus backplane mounted between the VMEmodule and transition module areas.
VMEbus Backplane P1\1 P1\2 P1\3 P1\4 P1\5 P1\6 P1\7 P1\8 P1\9 P2\1 P2\2 P2\3 P2\4 P2\5 P2\6 P2\7 P2\8 P2\9 8 FAN1 FAN2 PWR1 11032.00 9407 Figure 8-2.
Description SP1 SP2 P1\1 P1\2 P1\3 P1\4 P1\5 P1\6 P1\7 P1\8 P1\9 P1\10 P1\11 P1\12 SP3 SP4 8 SP5 P2\1 P2\2 P2\3 P2\4 P2\5 FAN1 PWR2 P2\6 P2\7 FAN2 P2\8 P2\9 P2\10 P2\11 P2\12 FAN3 PWR1 11030.00 9407 Figure 8-3.
VMEbus Backplane P1\ 1 P1\ 2 P1\ 3 P1\ 4 P1\ 5 P1\ 6 P1\ 7 P1\ 8 P1\ 9 P1\10 P1\11 P1\12 P1\13 P1\14 P1\15 P1\16 P1\17 P1\18 P1\19 P1\20 P2\ 1 P2\ 2 P2\ 3 P2\ 4 P2\ 5 P2\ 6 P2\ 7 P2\ 8 P2\ 9 P2\10 P2\11 P2\12 P2\13 P2\14 P2\15 P2\16 P2\17 P2\18 P2\19 P2\20 8 FAN1 PWR2 FAN2 FAN3 PWR1 10968.00 9405 Figure 8-4.
Description Specifications Table 8-4. Backplane Specifications Characteristics Specifications Physical characteristics Width (20-slot) Width (12-slot) Width (9-slot) Height Thickness 16.7 inches (405 mm) 16.7 inches (405 mm) 7.9 inches (141 mm) 16.5 inches (262 mm) 0.112 inches (2.845 mm) typical Temperature Operating Storage and transit 0° to 55° C (32° to 131° F) -55° to 85°C (-67° to 185° F) Relative humidity 0% to 90% noncondensing Power consumption (without VMEmodules) 6 W (1.
VMEbus Backplane Table 8-5.
Description Table 8-6.
VMEbus Backplane Table 8-7.
Features Features Signal Line Termination To prevent signal reflections, most signal lines not autojumpered are terminated with 470-ohm (pull down) and 330-ohm (pull up) resistors (a few lines have specialized terminators, depending on the nature of the signals they carry). These resistors are arranged in networks. They are permanently installed on the front of the backplane. For J1, the networks are located at opposite ends of the backplane adjacent to the first and last upper row (J1) connectors.
VMEbus Backplane VMEbus Interconnectivity The slots of the backplane are interconnected in accordance with the VME specification, with exception of the autojumpering and active termination. All rows of the J1 bus connectors (A, B, C) are interconnected across all backplane slots, providing the required signals for A24/D16 operation. The center row (B) of the J2 bus connectors is interconnected across all slots, providing the required signals for extended operation (A32/D32).
9Field Replacable Units 9 This chapter contains procedures for replacing the various Field Replacable Units (FRUs) in the XR series chassis.
Field Replacable Units – If the power supply is a DC unit, turn off the –24/–48Vdc power source and unplug the DC connector from the power supply input. 2. Remove the front bezel. 3. At the upper right side of the fan module, loosen the captive screw that holds the module in the chassis. 4. Slide the module out. 9 11314.00 9601 Replacement 1. Slide the fan module back into the chassis. Use firm, steady pressure to seat the connector properly in the backplane. 2.
3-Slot Chassis 3 1/2-Inch Drive Module The backplane of the system accommodates up to two 31/2-inch half-height storage devices in the drive bays located above the VMEmodule installation area. Removal 1. Switch the power supply of the system to the position (Standby) and disconnect the system from the AC or DC power source: – If the power supply is an AC unit, unplug the power cord from the AC outlet.
Field Replacable Units Replacement 1. Ensure that power to the system is set to the position (Standby) and that the system is disconnected from the AC or DC power source. 2. Note the device address setting on the drive you are replacing, and set the address switch on the new drive to the same device number. 3. Slide the replacement drive module gently into the drive bay until it contacts the backplane connector. 4. Use firm steady pressure to seat the drive connector in the backplane. 5.
Dual 9-, 12-, and 20-Slot Chassis Dual 9-, 12-, and 20-Slot Chassis Control Board The control board assembly controls the application of power to the VME backplane and the routing of alarm signals from the environmental monitoring system. The assembly consists of the control board, switch bracket, and keyswitch. It is held in the chassis by spring-loaded tabs on the switch bracket. 12- and 20-slot chassis are equipped with a single control board assembly; dual 9slot chassis have two of them.
Field Replacable Units Replacement 1. Ensure that the affected system is disconnected from the AC or DC power source. ! Caution To ensure a good connection to the backplane circuitry, check that the exposed connector pins on the side of the control board (J3) are straight before you install the board. 2. Slide the replacement control board assembly gently into the card guides until the pins of J3 (Figure 9-1 on page 9-7) touch the backplane connector. 3.
Dual 9-, 12-, and 20-Slot Chassis J3 11041.00 9408 9 11059.00 9409 Figure 9-1.
Field Replacable Units Fan Tray Removal/Replacement Three DC-powered fans (four fans in the dual 9-slot chassis) provide forced-air cooling for the VMEmodules and mass storage drives in the VME card cage. The fans (Figure 5-4) are mounted in a tray below the card cage. If a failure occurs in any of the fans, the tray is replaced as a unit. The suggested procedure for removal and replacement of the cooling fan tray is as follows: Removal 1.
Dual 9-, 12-, and 20-Slot Chassis MODULAR CARD CAGE ESD BOND POINT CABLES EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION EXPANSION CPU EXPANSION CABLES 9 FAN TRAY POWER SUPPLY 11028.00 9407 (1-3) Figure 9-2.
Field Replacable Units 12-Slot Chassis SCSI Drive The backplane of the 12-slot system accommodates up to five 5 1/4inch half-height storage devices to the left of the VMEmodule installation area (see Figure 9-3). If 3 1/2-inch devices are mounted in carrier adaptors, they can also plug directly into this area of the 12-slot backplane.
Dual 9-, 12-, and 20-Slot Chassis 2. Perform an operating system shutdown. Turn the AC or DC power off and remove the AC cord or DC power lines from the system. ! Inserting/removing modules while power is applied may result in damage to module components. Caution 3. Remove the chassis’ bezel. 4. Locate the drive address switch on the SCSI drive to be installed (see Figure 9-4). Set the drive address by turning the dial to the desired address number. Allowable addresses are 0-6.
Field Replacable Units Removal 1. Attach an ESD strap to your wrist. Attach the other end of the ESD strap to the chassis as a ground. The ESD strap must be secured to your wrist and to ground throughout the procedure. ! Avoid touching areas of integrated circuitry; static discharge can damage these circuits. Caution 2. Perform an operating system shutdown. Turn the AC or DC power off and remove the AC cord or DC power lines from the system.
Index Numerics 12-slot System Original XR Chassis 2-5 20-Slot System Extended XR Chassis 3-4 Original XR Chassis 2-7 3-Slot System Original XR Chassis 2-1 A About this Guide 1-3 The System Platforms 1-3 topics 1-3 AC power supply specifications 7-5 airflow blockages 6-14 alarm board 5-20, 6-15 ampere ratings 5-2 autojumpering 8-15 chassis grounding 5-21 Chassis Specifications Original XR Chassis 2-9 circuit breakers 5-4 circuit grounding 5-4 control cables 5-23 9-slot system 5-27 control panel 9-5 control
Index Extended XR Chassis 3-1 20-Slot System 3-4 Chassis Specifications 3-6 Dual 9-Slot System 3-2 Front Bezel Removal 3-8 Front Bezel Replacement 3-11 Overview 3-1 F fan 4-20 fan modules 6-9 fans system 6-9 features 1-1, 1-3 fiber optic cable 5-13 flanges, mounting 5-8 Front Bezel Removal Extended XR Chassis 3-8 Original XR Chassis 2-12 Front Bezel Replacement Extended XR Chassis 3-11 Original XR Chassis 2-14 G grounding 5-21 I indicator lights 6-1 indicators 6-3 Input power indicator 6-2 installation
Index power supply module 4-18, 7-1, 7-2, 7-4 publications related 1-4 R rack configuration system 5-8 rack mounting procedures 5-8 rack system cooling 6-7 radio-frequency interference (RFI) 2-12, 3-8, 4-8, 4-10 rating label, voltage 6-6 related publications 1-4 removal/replacement control board 9-5 cooling fan 4-20 fans 9-8 key switch 9-5 power supply 4-18, 7-2 resetting the system 6-3 S SCSI backplane 4-18 peripheral expansion chassis 5-16 termination 5-16 SCSI and environmental monitor cabling 5-24 SC
Index I N D E X IN-4
Cover 34 pages 1/8” spine 36 - 84 pages 3/16” & 1/4” spine XR Series System Chassis Reference Guide ® ™ ® ™ 86 - 100 pages 5/16” spine 102 - 180 pages 3/8” - 1/2” spine 182 - 308 pages 5/8” - 1 1/8” spine 2 lines allowed XR Series System Chassis Reference Guide ® ™
