MC68VZ328 Integrated Processor User's Manual

MAPBGA Package Dimensions
 Mechanical Data and Ordering Information 20-5
20.5 MAPBGA Package Dimensions
Figure 20-4 illustrates the MAPBGA 13 mm × 13 mm package, which has 1 mm spacing between the
pads. The device designator for the MAPBGA package is VF.
Figure 20-4. MC68VZ328 MAPBGA Mechanical Drawing
CASE 1242A-03
ISSUE B
4
Z
VIEW M-M
DETAIL K
M
A
DETAIL K
M
0.25 Z XY
Z0.1
3
b
144X
e11X
A1
A2
0.12 Z
5
0.2 Z
ROTATED 90 CLOCKWISE
°
DIM MIN MAX
MILLIMETERS
A --- 1.60
A1 0.27 0.47
A2 1.16 REF
b 0.40 0.60
D 13.00 BSC
E 13.00 BSC
e 1.00 BSC
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5. PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
12
e11X
E
D
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
X
0.2
Y
METALIZED MARK
FOR PIN 1 IDENTIFICATION
IN THIS AREA
111098 54321
A
B
C
D
E
F
G
H
J
K
L
M
S
S
S 0.50 BSC