MC68VZ328 Integrated Processor User's Manual

 Mechanical Data and Ordering Information 20-1
Chapter 20
Mechanical Data and Ordering
Information
This chapter provides mechanical data, including illustrations, and ordering information.
20.1 Ordering Information
Table 20-1 provides ordering information for the two package types: the 144-lead, plastic, thin quad flat
package (TQFP) and the 144-lead mold array process ball grid array (MAPBGA) package.
Table 20-1. MC68VZ328 Ordering Information
Package Type Frequency (MHz) Temperature Order Number
144-lead TQFP 33
0
O
C to 70
O
C
MC68VZ328PV33V
144-lead MAPBGA 33
0
O
C to 70
O
C
MC68VZ328VF33V
144-lead TQFP 33
-40
O
C to 85
O
C
MC68VZ328CPV33V
144-lead MAPBGA 33
-40
O
C to 85
O
C
MC68VZ328CVF33V