user manual

PrPMC800/800ET Processor PMC Module Installation and Use (PrPMC800A/IH5)
About This Manual
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Overview of Contents
Chapter 1, Preparation and Installation, provides a general description of the PrPMC800/800ET
including a summary of the basic features and architecture. It also includes a brief discussion
of the monarch and non-monarch use of this board, and the carrier board requirements when
the PrPMC800/800ET is being used as a monarch. The remainder of the chapter includes an
overview of the start-up procedures, general information on unpacking and hardware
preparation, and installation instructions.
Chapter 2, Operating Instructions, contains a section on applying power, a brief description of
status LEDs and debug serial ports.
Chapter 3, Functional Description, provides a list of the main features of the PrPMC800/800ET.
It also provides a general description of the board, a block diagram, and subsections on all of
the major components on the board, including configuration settings for the Harrier ASIC. In
addition, it also describes various key functions such as arbitration, setting flash memory,
memory size settings and system registers.
Chapter 4, Connector Pin Assignments, includes tables of pin assignments for all connectors
and headers on the board.
Chapter 5, PPCBug, includes a general discussion of PPCBug, the initialization process and
steps, and a brief summary of the use of PPCBug with a list of current commands. A list of the
current Diagnostic Test Groups is also included.
Chapter 6, Modifying the Environment, provides a general overview of how to change various
parameters within PPCBug firmware. It discusses two main commands: ENV and CNFG.
Appendix A, Specifications, provides basic mechanical, electrical and environmental
specifications for the PrPMC800/800ET, as well as a section on Thermal Validation offering
information on thermally significant components and an overview of how to measure various
junction and case temperatures.
Appendix B, Thermal Validation, provides systems integrators with information which can be
used to conduct thermal evaluations of the board in their specific system configuration.
Appendix C, Related Documentation, provides a list of other Motorola Embedded
Communications Computing related documents, applicable Manufacturer’s (vendor)
documents, and a list of related specifications.Comments and Suggestions
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