user manual

MC68HC05RC16 — Rev. 3.0 General Release Specification
MOTOROLA Mechanical Specifications 111
General Release Specification — MC68HC05RC16
Section 12. Mechanical Specifications
12.1 Contents
12.2 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111
12.3 28-Pin Plastic Dual-In-Line Package
(Case 710-02) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112
12.4 28-Pin Small Outline Integrated Circuit Package
(Case 751F-04) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112
12.5 44-Pin Plastic Leaded Chip Carrier Package
(Case 777-02) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
12.2 Introduction
This section describes the dimensions of the dual-in-line package (DIP),
small outline integrated circuit (SOIC), and plastic leaded chip carrier
(PLCC) MCU packages.
The following figures show the latest packages at the time of this
publication. To make sure that you have the latest package
specifications, contact one of the following:
• Local Motorola Sales Office
• Motorola Mfax
– Phone [phone]
– EMAIL [e-mail]
• Worldwide Web (wwweb) at http://design-net.com
Follow Mfax or wwweb on-line instructions to retrieve the current
mechanical specifications.