Microcontroller User's Manual

MOTOROLA Chapter 32. Mechanical Data 32-7
Ordering Information
Figure 32-2. 256 MAPBGA Package Dimensions
32.2 Ordering Information
Table 32-2. Orderable Part Numbers
Motorola Part
Number
Description Speed Temperature
MCF5280CVF66 MCF5280 RISC Microprocessor, 256 MAPBGA 66.67 MHz -40
° to +85° C
MCF5280CVF80 MCF5280 RISC Microprocessor, 256 MAPBGA 80 MHz -40
° to +85° C
MCF5281CVF66 MCF5281 RISC Microprocessor, 256 MAPBGA 66.67 MHz -40
° to +85° C
MCF5281CVF80 MCF5281 RISC Microprocessor, 256 MAPBGA 80 MHz -40
° to +85° C
MCF5282CVF66 MCF5282 RISC Microprocessor, 256 MAPBGA 66.67 MHz -40
° to +85° C
MCF5282CVF80 MCF5282 RISC Microprocessor, 256 MAPBGA 80 MHz -40
° to +85° C
X
Y
D
E
LASER MARK FOR PIN A1
IDENTIFICATION IN
THIS AREA
0.20
METALIZED MARK FOR
PIN A1 IDENTIFICATION
IN THIS AREA
M
M
3
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
123456710111213141516
e15X
e15X
b256X
M
0.25 YZ
M
0.10
X
Z
S
DETAIL K
VIEW M-M
ROTATED 90 CLOCKWISE
°
S
A
Z
Z
A2
A1
4
0.15
Z0.30
256X
5
K
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5. PARALLELISM MEASUREMENT SHALL
DIM MIN MAX
MILLIMETERS
A 1.25 1.60
A1 0.27 0.47
A2 1.16 REF
b 0.40 0.60
D 17.00 BSC
E 17.00 BSC
e 1.00 BSC
S 0.50 BSC