Technical information

Chapter 2: Hardware Interface Description
December 15, 2009 G30 - Module Hardware Description 49
Antenna Interface
Important: G30 has two basic hardware models that are differ from one another in the antenna
interface.
The first uses antenna interface with a U.FL connector, and the second uses RF B2B
pads in accordance with the table below.
When a U.FL connector module is used, the RF B2B pads are not connected, but the
design guidelines must be followed.
The board to board SMD pad 66 (ANT signal) has an impedance of 50
Ω and it provides the RF
antenna interface (see table below). The two pads close to the ANT pin (pads 52 and 54) are
ground pads and must be used to provide the connection of the RF antenna to the grounding
plane.
Caution: A RF keepout area exists near the RF ANT pad of the LGA interface. Verify this
area is left in-routed. Any use may result in permanent damage to the module.
Special layout design rules must be followed, refer to “Layout Recommendation”
on page 79.
If the module is soldered on a customized board, special care must be taken on the layout design
for the RF antenna pad which needs to be designed for 50
Ω impedance and suitable copper keep
out must be implemented below the RF test point.
The antenna or antenna application must be installed properly to achieve best performance.
Pin #
(81 pin
LGA
interface)
Pin #
(70 pin
connector
interface)
G30
Signal Name
G30
I/O
Function Remarks
66 NA ANT I/O RF antenna 50Ω nominal impedance.
(Applicable for G30 with-
out U.FL connector
model)
65,67 NA GND N/A RF isolated Ground Route Ground according
to “RF Recommenda-
tion” on page 80
.
NA ANT I/O RF Antenna (U.FL connec-
tor)
50Ω nominal impedance.
(Applicable for G30 with
U.FL connector model)