Technical information

Chapter 2: Hardware Interface Description
December 15, 2009 G30 - Module Hardware Description 29
• To avoid crosstalk between the SIM clock and data signals (SIM_CLK and SIM_DIO), it is
recommended to rout them separately on the application board, and preferably isolated by a
surrounding ground plane.
• The SIM card signals should be protected from ESD using very low capacitance protective
elements (zener diodes, etc.).
• The G30 interface does not support SIM programming through the VPP signal. This signal
should not be connected to G30.
Embedded SIM
The G30 incorporates an Embedded SIM (depending on G30 model).
Embedded SIM (e.g. eSIM or chip SIM), is a secured micro controller IC, with the same pinout
interface, and the same operation as an external SIM card.
The eSIM main advantage is it robustness, making it an ideal solution for the M2M, and
automotive application.
Since an eSIM is actually an IC soldered on the G30, it can withstand wider temperature range
than a regular external SIM card that is usually made of plastic, and gets twisted and bowed at
high temperature, causing disconnection inside the SIM tray.
For the same reason, the eSIM is more durable to vibration then a regular external SIM card. Hard
vibration on an application with a SIM card socket may result in with an intermitted connection
between the SIM card socket and the SIM card.
Note: When Embedded SIM is used, it is recommended to connect the SIM_PD_n signal to
ground. However, in case the SIM detection is disabled by SW (+MSMPD command),
this signal can be left disconnected.
eSIM Connection
Figure 2-13 illustrates a typical eSIM interface connection to G30.
Figure 2-13: G30 eSIM Interface
Note: When Embedded SIM is used, SIM_RST signal must be connected to eSIM_RESET
signal via an optional 0 ohm resistor.