Technical information

December 15, 2009 G30 - Module Hardware Description 3
Environmental
Operational temperature: -30°C to +85°C
Storage temperature: -40°C to +85°C
Performance
Operating voltage: 3.3 - 4.2 V
Current consumption: In AT mode: < 1.6 mA @ DRX9 (Sleep mode)
Maximum Tx output power: GSM 850/GSM 900: Power class 4 (33 ± 2dBm)
DCS 1800/PCS 1900: Power class 1 (30 ± 2 dBm)
GSM 850/GSM 900: GPRS 2 slot up (33 ± 2 dBm)
DCS 1800/PCS 1900: GPRS 2 slot up (30 ± 2 dBm)
Interfaces
Connectors: 81 pins LGA interface or via a single 70 pin connector
RF U.FL or via SMT pads
SIM Card: External SIM connectivity
1.8 V / 3.0 V SIM Card support
Embedded SIM
Connectivity: UART:
BR from 2400 bps to 230400 bps
Auto BR up to 230400 bps
I
2
C (Master, M2M Zone only):
I2S or SPI (Master data logging only, AT command selec-
tion)
RTC supply: RTC supply output/Backup voltage supply input
Reset: External Reset input
Data Features
GPRS: Multislot Class 10
DL up to 85.6 Kbit/s
UL up to 42.8 Kbit/s
Mobile station class B
CS1 to CS 4 supported
Internal TCP/IP
Embedded FTP
CSD: CS data calls (Transparent / Non-Transparent) up to 9.6
kbps
Modem type V.32, V.110
SMS: MO/MT Text and PDU modes
Cell broadcast (SMS CB)
Reception of SMS during circuit-switched calls
Reception of SMS via GSM or GPRS
Voice Features
Telephony
Digital/Analog audio
Headset Mode
Table 1-1: Product Specifications (Cont.)