Technical information

Soldering Re-flow
80 G30 - Module Hardware Description December 15, 2009
RF Recommendation
Note: The restrictions below are valid for both U.FL connector and RF PAD.
• Avoid ANY routing below RF Test-Point Round circle, and RF pad, Pin-66.
• Keep the RF TP area and its clearance area cleared from Routing and GND (internal layers
also), at least 0.45mm below the G30.
• RF PAD must be connected with a 50 ohm controlled impedance Line.
• Keep the RF PAD area cleared from GND (internal layers also), at least 0.45mm below the
G30.
• Cover all Pads area with inner GND Layer below the 0.45mm routing clearance.
Soldering Re-flow
G30 LGA recommended soldering re-flow condition are max 237 C for 5 second duration.
Note: Any G30 LGA removal must be performed according to IPC-7711 standard "Rework of
Electronic Assemblies" chap 3.9.1 or 3.9.2 regarding “BGA/CSP Removal”. The
IPC-7711 can be found at www.ipc.org.