User's Manual

4
10.1.
Gemini Processor Architecture................................................................................................................................ 51
10.2. General Definitions ................................................................................................................................................. 51
10.3. Initialization............................................................................................................................................................. 51
10.4. IPC Commands/Protocols ....................................................................................................................................... 51
10.5. IPC Channel Configuration ..................................................................................................................................... 51
10.6. DL-CNTL (multiplexer control).............................................................................................................................. 51
10.7. DL-TEL (AT Telephony & Control)....................................................................................................................... 51
10.8. AT availability......................................................................................................................................................... 51
10.9. DL-SIM (SIM access control) ................................................................................................................................. 51
3.3.6. DL-AUD_CNTL ................................................................................................................................................ 51
3.3.7. DL-DATA1 (Internal Packet Data) .................................................................................................................... 51
3.3.8. DL-DATA2 (External Packet Data and Circuit Data control)............................................................................ 51
10.10. DL-NMEA (GPS data) ....................................................................................................................................... 51
11. HARDWARE............................................................................................................................................................... 51
11.1. GENERAL .............................................................................................................................................................. 51
11.2. HOST INTERFACE................................................................................................................................................ 51
12. TESTING ..................................................................................................................................................................... 51
12.1. GENERAL .............................................................................................................................................................. 51
12.2. TESTING STAGES ................................................................................................................................................ 51
12.3. Hardware Integration............................................................................................................................................... 51
12.4. Enabler Functions.................................................................................................................................................... 51
12.5. Specific Tests .......................................................................................................................................................... 51
12.6. Desense and EMI..................................................................................................................................................... 51
12.7. Regulatory Compliance ........................................................................................................................................... 51
12.8. Application Software............................................................................................................................................... 51
12.9. Final Assembly........................................................................................................................................................ 51
12.10. End User Problem Resolution............................................................................................................................. 51
12.11. OEM Service Depot Repair ................................................................................................................................ 51
12.12. TROUBLESHOOTING ..................................................................................................................................... 51
13. SPECIFICATIONS...................................................................................................................................................... 51
13.1. GENERAL .............................................................................................................................................................. 51
13.2. MODEL SPECIFICATIONS .................................................................................................................................. 51
13.3. PIN DESCRIPTIONS ............................................................................................................................................. 51
13.4. Main Interface Connector........................................................................................................................................ 51
13.5. SIM Interface Connector ......................................................................................................................................... 51
13.6. MECHANICAL SPECIFICATION DIAGRAMS.................................................................................................. 51
14. GLOSSARY................................................................................................................................................................. 51
15. REFERENCES............................................................................................................................................................. 51
16. DESENSE .................................................................................................................................................................... 51
17. PC Applications ........................................................................................................................................................... 51
17.1. Upgrade Utility Application .................................................................................................................................... 51
17.2. Diagnostic application ............................................................................................................................................. 51
17.3. RF Tester Utility...................................................................................................................................................... 51
18. PPP Connection Setup.................................................................................................................................................. 51
18.1. Optional step (see note on page 6): Standard Modem setting instructions.............................................................. 51
18.2. Baud Rate ................................................................................................................................................................ 51