User's Manual

APPLICANT: MOTOROLA, INC. FCC ID: IHDT6AC1
Exhibit 8
47
D15 DVG with GPS: 49g
D15 DV DIN: 22g
Volume: D15 DV Standard: cc
D15 DV Slim: cc
D15 DVG with GPS: cc
D15 DV DIN: cc
Housing
material:
Plastic housing PC/ABS
d15 DV Standard / Slim/
DVG:
36 pin ZIF socket @
0.5mm pitch
ELCO #04-6240-036-800
d15 DV Vertical Board
Only:
28 pin dual in line
Header @1.27 pitch
(SAMTEC # FTSH-114 -01-
L-DH)
Interface
connector:
d15 DV Horizontal Board
Only:
28 pin dual in line pin
socket @1.27 pitch
SAMTEC # CLP-114-02-L-D)
RF output
connector:
MMCX Jack (female) 50Ω GSM and GPS Mating
connectors Plug (Male)
Coax Huber-Shuhner Johnson Components
RG178 11-MMCX-50-1-1 135-3302-001
RG316 11-MMCX-50-2-3 135-3403-001
Environmenta
l
Operational
temperature:
-30 to +60 degrees C
Storage
temperature:
-40 to +85 degrees C
Shock: 20 g’s with 11 millisecond duration, 20 impacts
in three mutually perpendicular planes
Vibration: IS-19: 1.5g acceleration, 5 to 500 Hz @ 0.1
octave/minute in three mutually perpendicular
planes
Performance
Operating
systems
GSM 900MHz, DCS 1800MHz, PCS 1900MHz.
Voltage:® 3.0 to 6V
Current: 10 mA Stand by
150uA off current
300mA avg. in call at power level 5
1.2 A peak @ 217 Hz at power level 5
Power out: GSM – Power levels #19 to 5, 5dBm to 33dBm per
ETSI.
DCS – Power levels # 15 to 0, 0dBm to 30 dBm per