Specifications

Intel

810E2 Chipset Platform

98 Design Guide

Figure 58. Dual-Footprint Analog Interface

dual_ft_AN_conn

Magnetics

Module

TDP

RJ45

82562EH/82562ET

TDN

RDP

RDN

RJ11

TXP

TXN

Tip

Ring

82562EH

Config.

82562ET

Config.

The following are additional guidelines for this configuration:

• L = 3.5” to 10.0”

• Stub < 0.5”

• Either 82562EH or 82562ET/82562EM can be installed, but not both.

• 82562ET pins 28, 29, and 30 overlap with 82562EH pins 17, 18, and 19.

• Overlapping pins are tied to ground.

• No other signal pads should overlap or touch.

• Signal lines LAN_CLK, LAN_RSTSYNC, LAN_RXD[0], LAN_TXD[0], RDP, RDN, RXP/Ring,

and RXN/Tip are shared by the 82562EH and 82562ET configurations.

• No stubs should be present when 82562ET is installed.

• Packages used for the dual footprint are TQFP for 82562EH and SSOP for 82562ET.

• A 22-Ω resistor can be placed at the driving side of the signal line to improve signal quality on the

LAN connect interface.

• Resistor should be placed as close as possible to the component.

• Use components that can satisfy both the 82562ET and 82562EH configurations

(i.e., magnetics module).

• Install components for either the 82562ET or the 82562EH configuration. Only one configuration

can be installed at a time.

• Route shared signal lines such that stubs are not present or are kept to a minimum.

• Stubs may occur on shared signal lines (i.e., RDP and RDN). These stubs are due to traces routed to

an uninstalled component.

• Use 0-Ω resistors to connect and disconnect circuitry not shared by both configurations. Place

resistor pads along the signal line to reduce stub lengths.