Specifications
Intel
®
 810E2 Chipset Platform     
R
92 Design Guide 
Distance from Intel
®
 82562EH to Magnetics Module 
Due to the high speed of signals present, distance ‘A’ between the 82562EH and the magnetic should 
also be less than 1”, but should be second priority relative to distance from connects to the magnetic 
module. 
Generally speaking, any section of trace intended for use with high-speed signals should be subject to 
proper termination practices. Proper signal termination can reduce reflections caused by impedance 
mismatches between the device and trace route. The reflections of a signal may have a high-frequency 
component that may contribute more EMI than the original signal itself. 
Distance from LPF to Phone RJ11 
This distance ‘C’ should be less then 1”. Regarding trace symmetry, route differential pairs with 
consistent separation and with exactly the same lengths and physical dimensions. 
Asymmetrical and unequally long differential pairs contribute to common-mode noise. This can degrade 
the receive circuit performance and contribute to emissions radiated from the transmit side 
3.21.4. Intel
®
 82562ET / 82562EM Guidelines 
Related Documents 
•  82562ET Platform LAN Connect (PLC) Datasheet 
•  PCB Design for the 82562 ET/EM Platform LAN Connect 
For correct LAN performance, designers must follow the general guidelines outlined in Section 3.21.2. 
Additional guidelines for implementing a 82562ET or 82562EM LAN connect component are as 
follows. 
3.21.4.1.  Guidelines for Intel
®
 82562ET / 82562EM Component Placement 
Component placement can affect the signal quality, emissions, and temperature of a board design. This 
section provides guidelines for component placement. 
Careful component placement can: 
•  Decrease potential problems directly related to electromagnetic interference (EMI), which could 
result in failure to meet FCC and IEEE test specifications. 
•  Simplify the task of routing traces. To some extent, component orientation will affect the 
complexity of trace routing. The overall objective is to minimize turns and crossovers between 
traces. 
It is important to minimize the space needed for the Ethernet LAN interface, because all other interfaces 
will compete for physical space on a motherboard near the connector edge. As with most subsystems, the 
Ethernet LAN circuits must be as close as possible to the connector. Thus, it is imperative that all designs 
be optimized to fit in a very small space. 










