Specifications

Intel
®
810E2 Chipset Platform
R
Design Guide 7
7.2.6.
Interrupt Interface ...................................................................................... 165
7.2.7. GPIO Checklist.......................................................................................... 166
7.2.8. USB ...................................................................................................... 167
7.2.9. Power Management .................................................................................. 168
7.2.10. Processor Signals ..................................................................................... 168
7.2.11. System Management ................................................................................ 169
7.2.12. ISA Bridge Checklist.................................................................................. 169
7.2.13. RTC ...................................................................................................... 169
7.2.14. AC’97 ...................................................................................................... 170
7.2.15. Miscellaneous Signals............................................................................... 170
7.2.16. Power ...................................................................................................... 172
7.2.17. IDE Checklist............................................................................................. 173
7.3. LPC Checklist.............................................................................................................. 175
7.4. System Checklist......................................................................................................... 176
7.5. FWH Checklist ............................................................................................................ 176
7.6. Clock Synthesizer Checklist ........................................................................................ 177
7.7. ITP Probe Checklist..................................................................................................... 178
7.8. Power Delivery Checklist............................................................................................. 178
8. Flexible Motherboard Guidelines ............................................................................................. 179
8.1. Flexible Processor Guidelines..................................................................................... 179
8.1.1. Flexible System Design DC Guidelines..................................................... 179
8.1.2. System Bus AC Guidelines ....................................................................... 181
8.1.3. Thermal Guidelines ................................................................................... 184
9. Third-Party Vendor Information................................................................................................ 185
Appendix A: Intel
®
810E2 Chipset Platform Reference Schematics ............................................................ 189