Specifications

Intel
®
810E2 Chipset Platform
R
42 Design Guide
Figure 10. Nominal Board Stackup
Component Side Layer 1 (1/2 oz. cu)
Power Plane Layer 2 (1 oz. cu)
Ground Layer 3 (1 oz. cu)
Solder SIde Layer 4 (1/2 oz. cu)
4.5 mil Prepreg
4.5 mil Prepreg
~48 mil Core
62 mils
Total
Thickness
stackup.vsd
3.1 Component Quadrant Layouts
Figure 11. GMCH Quadrant Layout (top View)
CRT Display
Digital
Video
Out
Display
Cache
System Bus
Hub
Interface
System
Memory
System
Memory
System Bus
GMCH Top View
Pin A1