Specifications

Intel
®
810E2 Chipset Platform
R
Design Guide 39
2.2.13. PGA370 Socket Connector Strapping Option
Clarifications of the keep-out zone changes are as follows:
• An increase in the height of the heatsink volumetric area from 2.10” to 2.52” including a 0.420”
area above the heatsink to allow adequate area for fan inlet air.
• Growth in the x direction of the top of the heatsink keep-out zone from 2.55” to 3.504“ to enable a
thumb tab for a heatsink-attach clip
• Growth in the x direction of the bottom of the heatsink keep-out zone from 2.55” to 2.70” to enable
a fan/shroud heatsink attach mechanism.
OEMs can anticipate that the Intel reference design thermal solution will be larger than Intel Celeron
processor thermal solutions. Enlarging this thermal solution may cause interference fit issues, please
ensure that if you plan on using the Intel Reference solution, the motherboard and system can
accommodate these adjusted dimensions.
Figure 9. Component Keep-Out Zones
Note: Performance results of Intel reference design thermal solutions are dependent upon multiple system
parameters and should therefore be evaluated individually by perspective users. *Actual required
transition points (processor speed) for OEMs should be determined through system-level thermal
evaluation.