Specifications

Intel
®
810E2 Chipset Platform
R
Design Guide 31
Table 7. Routing Guidelines for Non-AGTL+ Signals
Signal Trace Width Spacing to Other Traces Trace Length
A20M# 5 mils 10 mils 1” to 6”
FERR# 5 mils 10 mils 1” to 6”
FLUSH# 5 mils 10 mils 1” to 6”
IERR# 5 mils 10 mils 1” to 6”
IGNNE# 5 mils 10 mils 1” to 6”
INIT# 5 mils 10 mils 1” to 6”
LINT[0] (INTR) 5 mils 10 mils 1” to 6”
LINT[1] (NMI) 5 mils 10 mils 1” to 6”
PICD[1:0] 5 mils 10 mils 1” to 8”
PREQ# 5 mils 10 mils 1” to 6”
PWRGOOD 5 mils 10 mils 1” to 6”
SLP# 5 mils 10 mils 1” to 6”
SMI# 5 mils 10 mils 1” to 6”
STPCLK 5 mils 10 mils 1” to 6”
THERMTRIP# 5 mils 10 mils 1” to 6”
2.2.2.3. THRMDP and THRMDN
These traces (THRMDP and THRMDN) route the processor’s thermal diode connections. The thermal
diode operates at very low currents and may be susceptible to crosstalk. The traces should be routed
close together to reduce loop area and inductance (Refer to the figure below).
Figure 3. Routing for THRMDP and THRMDN
1 -- Maximize (min - 20 mils)
1 -- Maximize (min - 20 mils)
2 -- Minimize
Signal Y
THRMDP
THERMDN
Signal Z
• Rule
 Length Equalization route these traces parallel ±0.5”
 Layer route both on the same layer