Specifications

Intel
®
810E2 Chipset Platform
R
184 Design Guide
8.1.3. Thermal Guidelines
The following table provides the recommended thermal design power dissipation for use in designing a
flexible system board. The processor’s heatslug is the attach location for all thermal solutions. The
maximum and minimum case temperatures are specified in the following table. A thermal solution should
be designed to ensure the temperature of the case never exceeds these specifications.
Table 53. Intel
®
Celeron
®
Processor PPGA Flexible Thermal Design Power
1, 2
Processor Power
(W)
Minimum TCASE
(°C)
Maximum T
CASE
(°C)
30.02 0 70
NOTES:
1. These values are specified at nominal Vcc
CORE
for the processor core.
2. These values are preliminary.