Specifications

Intel
®
810E2 Chipset Platform
R
178 Design Guide
7.7. ITP Probe Checklist
Checklist Items Recommendations
R_TCK, TCK R_TMS, TMS Connect to 370-Pin socket through 47-Ω resistor and pull up to
VCMOS.
ITPRDY#, R_ITPRDY# Connect to 370-Pin socket through 243-Ω resistor.
TDI Pull up through 330-Ω resistor to VCMOS.
TDO Pull up through 150-Ω resistor to VCMOS.
PLL1 See Design Guide.
PLL2 See Design Guide.
7.8. Power Delivery Checklist
Checklist Items Recommendations
All voltage regulator components meet
maximum current requirements.
Consider all loads on a regulator, including other regulators.
All regulator components meet thermal
requirements.
Ensure the voltage regulator components and dissipate the
required amount of heat.
VCC1_8 VCC1_8 power sources must supply 1.8 V and be between
1.71 V to 1.89 V.
If devices are powered directly from a dual
rail (i.e., not behind a power regulator), then
the RDSon of the FETs used to create the
dual rail must be analyzed to ensure there is
not too much voltage drop across the FET.
“Dual” voltage rails may not be at the expected voltage.
Dropout voltage The minimum dropout for all voltage regulators must be
considered. Take into account that the voltage on a dual rail may
not be the expected voltage.
Voltage tolerance requirements are met. See the individual component specifications for each voltage
tolerance.
Total power consumption in S3 must be less
than the rated standby supply current.
Adequate power must be supplied by power supply.