Specifications
Intel
®
 810E2 Chipset Platform     
R
16 Design Guide 
 Term   Definition 
Pad  A feature of a semiconductor die contained within an internal logic package on the 
S.E.C cartridge substrate used to connect the die to the package bond wires. A pad is 
only observable in simulation. 
Pin  A feature of a logic package contained within the S.E.C. cartridge used to connect the 
package to an internal substrate trace. 
Ringback  Ringback is the voltage that a signal rings back to after achieving its maximum absolute 
value. Ringback may be due to reflections, driver oscillations, etc. See the respective 
processor’s datasheet for ringback specification. 
Settling Limit  Defines the maximum amount of ringing at the receiving pin that a signal must reach 
before its next transition. See the respective processor’s datasheet for settling limit 
specification. 
Setup Window  Is the time between the beginning of Setup to Clock (T
SU_MIN
) and the arrival of a valid 
clock edge. This window may be different for each type of bus agent in the system. 
Simultaneous Switching 
Output (SSO) Effects 
Refers to the difference in electrical timing parameters and degradation in signal quality 
caused by multiple signal outputs simultaneously switching voltage levels (e.g., high-to-
low) in the opposite direction from a single signal (e.g., low-to-high) or in the same 
direction (e.g., high-to-low). These are respectively called odd-mode switching and 
even-mode switching. This simultaneous switching of multiple outputs creates higher 
current swings that may cause additional propagation delay (or “pushout”), or a 
decrease in propagation delay (or “pull-in”). These SSO effects may impact the setup 
and/or hold times and are not always taken into account by simulations. System timing 
budgets should include margin for SSO effects. 
Stub  The branch from the trunk terminating at the pad of an agent. 
Test Load  Intel uses a 50 Ω test load for specifying its components. 
Trunk  The main connection, excluding interconnect branches, terminating at agent pads.  
Undershoot  Maximum voltage allowed for a signal to extend below VSS at the processor core pad. 
See the respective processor’s datasheet for undershoot specifications. 
Victim  A network that receives a coupled crosstalk signal from another network is called the 
victim network. 
VREF Guardband  A guardband (DV
REF
) defined above and below V
REF
 to provide a more realistic model 
accounting for noise such as crosstalk, V
TT
 noise, and V
REF
 noise. 










