Specifications
Intel
®
 810E2 Chipset Platform     
R
10 Design Guide 
Tables 
Table 1. Platform Pin Definition Comparison for Single Processor Designs ............................26 
Table 2. Intel
®
 Pentium
®
 III Processor and Intel
®
 82810E GMCH AGTL+ Parameters for 
Example Calculations........................................................................................................27
Table 3. Example T
FLT_MIN
 Calculations for 133 MHz Bus
1
.......................................................28 
Table 4. Example TFLT_MIN Calculations (Frequency Independent)
1
.......................................28 
Table 5. Segment Descriptions and Lengths for Figure 2 
1
......................................................29 
Table 6. Trace Width:Space Guidelines...................................................................................29 
Table 7. Routing Guidelines for Non-AGTL+ Signals ...............................................................31 
Table 8. Intel
®
 CK810E Reset Strapping Matrix .......................................................................33 
Table 9. Examples for CLKREF Divider Circuit........................................................................34 
Table 10. Power Up Options ....................................................................................................36 
Table 11. Host Frequency Strappings ......................................................................................36 
Table 12. System Memory Routing ..........................................................................................46 
Table 13. Display Cache Routing (Topology 1) ........................................................................49 
Table 14. Display Cache Routing (Topology 2) ........................................................................49 
Table 15. Display Cache Routing (Topology 3) ........................................................................50 
Table 16. Display Cache Routing (Topology 4) ........................................................................50 
Table 17. Decoupling Capacitor Recommendation..................................................................54 
Table 18. AC'97 SDIN Pull-down Resistors..............................................................................64 
Table 19. Signal Descriptions...................................................................................................67 
Table 20. Codec Configurations ...............................................................................................68 
Table 21. Pull-up Requirements for SMBus and SMLink .........................................................72 
Table 22. LAN Design Guide Section Reference .....................................................................80 
Table 23. Single-Solution Interconnect Length Requirements .................................................81 
Table 24. LOM/CNR Length Requirements..............................................................................82 
Table 25. Inductor...................................................................................................................102 
Table 26. Capacitor ................................................................................................................102 
Table 27. Resistor ..................................................................................................................102 
Table 28. DPLL LC Filter Component Example .....................................................................110 
Table 29. Additional DPLL LC Filter Component Example.....................................................111 
Table 30. Resistance Values for Frequency Response Curves.............................................112 
Table 31. AGTL+ Parameters for Example Calculations 
1,2
....................................................115 
Table 32. Example T Calculations for 133 MHz Bus
1
.............................................................116 
Table 33. Example TFLT_MIN Calculations (Frequency Independent) ....................................116 
Table 34. Trace Width Space Guidelines...............................................................................120 
Table 35. REFCLK Reset Strap for CK810 vs. CK810E ........................................................133 
Table 36. Intel
®
 810E2 Chipset Clocks...................................................................................133 
Table 37. Group Skew and Jitter Limits at the Pins of the Clock Chip ...................................136 
Table 38. Signal Group and Resistor .....................................................................................136 
Table 39. Layout Dimensions .................................................................................................137 
Table 40. Clock Skew Requirements .....................................................................................142 
Table 41. Power Sequencing Timing Definitions....................................................................148 
Table 42. AGTL+ Connectivity Checklist for 370-Pin Socket Processors ..............................158 
Table 43. CMOS Connectivity Checklist for 370-Pin Socket Processors...............................159 
Table 44. TAP Checklist for a 370-Pin Socket Processor ......................................................159 
Table 45. Miscellaneous Checklist for 370-Pin Socket Processors .......................................160 
Table 46. GMCH Checklist .....................................................................................................161 
Table 47. System Memory Checklist ......................................................................................162 
Table 48. Display Cache Checklist.........................................................................................162 
Table 49. Flexible Processor Voltage and Current Guidelines for 1.5V Processors ..............179 
Table 50. Flexible Processor Voltage and Current Guidelines for 2.0 V Processors .............180 










