Specifications

Intel
®
810E2 Chipset Platform
R
10 Design Guide
Tables
Table 1. Platform Pin Definition Comparison for Single Processor Designs ............................26
Table 2. Intel
®
Pentium
®
III Processor and Intel
®
82810E GMCH AGTL+ Parameters for
Example Calculations........................................................................................................27
Table 3. Example T
FLT_MIN
Calculations for 133 MHz Bus
1
.......................................................28
Table 4. Example TFLT_MIN Calculations (Frequency Independent)
1
.......................................28
Table 5. Segment Descriptions and Lengths for Figure 2
1
......................................................29
Table 6. Trace Width:Space Guidelines...................................................................................29
Table 7. Routing Guidelines for Non-AGTL+ Signals ...............................................................31
Table 8. Intel
®
CK810E Reset Strapping Matrix .......................................................................33
Table 9. Examples for CLKREF Divider Circuit........................................................................34
Table 10. Power Up Options ....................................................................................................36
Table 11. Host Frequency Strappings ......................................................................................36
Table 12. System Memory Routing ..........................................................................................46
Table 13. Display Cache Routing (Topology 1) ........................................................................49
Table 14. Display Cache Routing (Topology 2) ........................................................................49
Table 15. Display Cache Routing (Topology 3) ........................................................................50
Table 16. Display Cache Routing (Topology 4) ........................................................................50
Table 17. Decoupling Capacitor Recommendation..................................................................54
Table 18. AC'97 SDIN Pull-down Resistors..............................................................................64
Table 19. Signal Descriptions...................................................................................................67
Table 20. Codec Configurations ...............................................................................................68
Table 21. Pull-up Requirements for SMBus and SMLink .........................................................72
Table 22. LAN Design Guide Section Reference .....................................................................80
Table 23. Single-Solution Interconnect Length Requirements .................................................81
Table 24. LOM/CNR Length Requirements..............................................................................82
Table 25. Inductor...................................................................................................................102
Table 26. Capacitor ................................................................................................................102
Table 27. Resistor ..................................................................................................................102
Table 28. DPLL LC Filter Component Example .....................................................................110
Table 29. Additional DPLL LC Filter Component Example.....................................................111
Table 30. Resistance Values for Frequency Response Curves.............................................112
Table 31. AGTL+ Parameters for Example Calculations
1,2
....................................................115
Table 32. Example T Calculations for 133 MHz Bus
1
.............................................................116
Table 33. Example TFLT_MIN Calculations (Frequency Independent) ....................................116
Table 34. Trace Width Space Guidelines...............................................................................120
Table 35. REFCLK Reset Strap for CK810 vs. CK810E ........................................................133
Table 36. Intel
®
810E2 Chipset Clocks...................................................................................133
Table 37. Group Skew and Jitter Limits at the Pins of the Clock Chip ...................................136
Table 38. Signal Group and Resistor .....................................................................................136
Table 39. Layout Dimensions .................................................................................................137
Table 40. Clock Skew Requirements .....................................................................................142
Table 41. Power Sequencing Timing Definitions....................................................................148
Table 42. AGTL+ Connectivity Checklist for 370-Pin Socket Processors ..............................158
Table 43. CMOS Connectivity Checklist for 370-Pin Socket Processors...............................159
Table 44. TAP Checklist for a 370-Pin Socket Processor ......................................................159
Table 45. Miscellaneous Checklist for 370-Pin Socket Processors .......................................160
Table 46. GMCH Checklist .....................................................................................................161
Table 47. System Memory Checklist ......................................................................................162
Table 48. Display Cache Checklist.........................................................................................162
Table 49. Flexible Processor Voltage and Current Guidelines for 1.5V Processors ..............179
Table 50. Flexible Processor Voltage and Current Guidelines for 2.0 V Processors .............180