Datasheet

IEC 60695-2-11 and any applicable product end-
use standard(s). <P> If it is determined during the
customer’s evaluation of suitability, that higher
performance is required, please contact Molex for
possible product options."""""""
Overview Micro-Fit Connector System
PITCH-MATING-NUMERIC 3.00
Product Literature Order No 987650-5984
Product Name Micro-Fit 3.0
UPC 800754371230
Physical
Breakaway No
Circuits (Loaded) 6
Circuits (maximum) 6
Color - Resin Black
Durability (mating cycles max) 30
Flammability 94V-0
Glow-Wire Capable Yes
Mated Height 17.64mm
Material - Metal Brass
Material - Plating Mating Gold
Material - Plating Termination Tin
Material - Resin High Temperature Thermoplastic
Net Weight 0.974/g
Number of Rows 2
Orientation Vertical
PCB Locator Yes
PCB Retention Yes
PCB Thickness - Recommended 1.60mm
Packaging Type Tray
Pitch - Mating Interface 3.00mm
Plating min - Mating 0.381µm
Polarized to PCB Yes
Shrouded Fully
Stackable No
Surface Mount Compatible (SMC) Yes
Temperature Range - Operating -40° to +105°C
Termination Interface: Style Through Hole - Kinked Pin
Electrical
Current - Maximum per Contact 8.5A
Voltage - Maximum 600V
Solder Process Data
Duration at Max. Process Temperature (seconds) 030
Lead-freeProcess Capability SMC&WAVE
Max. Cycles at Max. Process Temperature 003
Process Temperature max. C 260
Material Info
Reference - Drawing Numbers
Packaging Specification PK-70873-0314-001
Sales Drawing SD-43045-005
Symbol/Footprint Data SYM-43045-0612, SYM-43045-061X
Test Summary TS-43045-001-001, TS-43045-002-001,
TS-46235-001-001
This document was generated on 07/26/2019
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