PRODUCT SPECIFICATION TITLE 2.4GHZ/5GHZ CERAMIC SMT ANTENNA TABLE OF CONTENTS 1.0 SCOPE 2.0 PRODUCT DESCRIPTION 3.0 APPLICABLE DOCUMENTS 4.0 GENERAL SPECIFICATION 5.0 ANTENNA SPECIFICATION 6.0 MECHANICAL REQUIREMENTS 7.0 ENVIRONMENTAL SPECIFICATION 8.0 RECOMMENDED REFLOW CONDITION 9.0 RECOMMENDED FOOTPRINT ON PCB FOR SOLDERING 10.0 PACKING REVISION: ECR/ECN INFORMATION: B EC No: DATE: 2018/12/20 DOCUMENT NUMBER: PS-2119640001 SHEET No. 2.
PRODUCT SPECIFICATION 2.4GHZ/5GHZ CERAMIC SMT ANTENNA 1.0 SCOPE This product specification covers the mechanical, electrical and environmental performances specification for 2.4GHz/5GHz Ceramic SMT antenna. 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND SERIES NUMBER (S) Product name: 2.4GHz/5GHz Ceramic SMT antenna. Series Number: 211964**** 2.2 DESCRIPTION 211964 is 2.4GHz/5GHz ceramic loop antenna. It works very well when being placed at PCB Center-edge.
PRODUCT SPECIFICATION 2.4 PRODUCT STRUCTURE INFORMATION P/N 2119640001 MECHANICAL STRUCTURE INFORMATION FOR 2119640001 3.0 APPLICABLE DOCUMENTS DOCUMENT NUMBER DESCRIPTION Sale Drawing(SD) SD-2119640001 Mechanical Dimension of the product Application Guide(AS) AS-2119640001 Antenna Application and surrounding Packing Drawing(PK) PK-2119640001 Product packaging specifications REVISION: ECR/ECN INFORMATION: B EC No: DATE: 2018/12/20 DOCUMENT NUMBER: PS-2119640001 SHEET No. 2.
PRODUCT SPECIFICATION 4.0 GENERAL SPECIFICATION PRODUCT NAME 2.4GHz/5GHz Ceramic SMT antenna PART NUMBER 2119640001 FREQUENCY RANGE 2400~2500MHz or 2400~2500MHz and 5150~5850MHz POLARIZATION Linear IMPEDANCE WITH MATCHING 50 Ohms STORAGE TEMPERATURE -40℃ to 85℃ RELATIVE HUMIDITY 55%-75% RF POWER 2 Watts ANTENNA TYPE LTCC CERAMIC DIMENSION 3.2x1.6x1.2 mm SINGLE WEIGHT 0.0192g/ pcs Note: if you plan to re-use the products that be taken out from packaging.
PRODUCT SPECIFICATION 6.0 MECHANICAL REQUIREMENTS DESCRIPTION TEST CONDITION TEST RESULT SHEAR FORCE Apply push force on parts soldered on the PCB at the speed rate of 253 mm/minute. Shear force:＞10N 7.0 ENVIRONMENTAL SPECIFICATION DESCRIPTION SPECIFICATION 1. The device under test is kept for 12 hours in an environment with a temperature of 55 degrees and a relating humidity of 95%. Thereafter for 12 Hours in an environment with a temperature of 25 degrees and a relative humidity of 95%.
PRODUCT SPECIFICATION 8.0 RECOMMENDED REFLOW CONDITION Recommended solder paste: ALPHA CAP-390 SAC305; Recommended stencil thickness: 0.1MM≤ T ≤ 0.15MM; For mechanically challenging applications. Molex recommends using surface mount glue (e.g. Loctite 3611) before reflow soldering process to ensure increased mechanical retention on the PCB. REVISION: ECR/ECN INFORMATION: B EC No: DATE: 2018/12/20 DOCUMENT NUMBER: PS-2119640001 SHEET No. 2.
PRODUCT SPECIFICATION 9.0 LAYOUT DIMENSIONS 9.1 PADS OF PRODUCT FOR SOLDERING 9.2 RECOMMENDED FOOTPRINT ON PCB FOR SOLDERING IN TWO CONFIGS REVISION: ECR/ECN INFORMATION: B EC No: DATE: 2018/12/20 DOCUMENT NUMBER: PS-2119640001 SHEET No. 2.4GHz/5GHz Ceramic SMT Product Specification 7 of 11 CREATED / REVISED BY: CHECKED BY: APPROVED BY: Cooper Zhou2018/12/20 Yuxi Gao 2018/12/20 Stary Song 2018/12/20 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).
PRODUCT SPECIFICATION 9.3 RECOMMENDED PCB CLEARANCE KEEP OUT AREA FOR TWO CONFIGS Front side of PCB Back side of PCB Recommended PCB keep out area = 6x4mm Clearance area :4.00x4.10mm (Front Side) 9.5 MATCHING NETWORK DESCRIPTION The recommended matching network shown in Figure below. RECOMMENDED MATCHING CIRCUIT SCHEMATIC REVISION: ECR/ECN INFORMATION: B EC No: DATE: 2018/12/20 DOCUMENT NUMBER: PS-2119640001 SHEET No. 2.
PRODUCT SPECIFICATION Component Configure 1 Configure 2 2.7pF 4.7nH C1 Murata (PN: GRM1555C1H2R7WA01) Murata (PN: LQW15AN4N7B00) C2 0Ω 0.6pF Murata (PN: GRM1555C1HR60BA01D) RECOMMENDED MATCHING CIRCUIT REVISION: ECR/ECN INFORMATION: B EC No: DATE: 2018/12/20 DOCUMENT NUMBER: PS-2119640001 SHEET No. 2.
PRODUCT SPECIFICATION 10 PACKING REVISION: ECR/ECN INFORMATION: B EC No: DATE: 2018/12/20 DOCUMENT NUMBER: PS-2119640001 SHEET No. 2.4GHz/5GHz Ceramic SMT Product Specification 10 of 11 CREATED / REVISED BY: CHECKED BY: APPROVED BY: Cooper Zhou2018/12/20 Yuxi Gao 2018/12/20 Stary Song 2018/12/20 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).
PRODUCT SPECIFICATION PACKAGING INFORMATION FOR 2119640001 REVISION: ECR/ECN INFORMATION: B EC No: DATE: 2018/12/20 DOCUMENT NUMBER: PS-2119640001 SHEET No. 2.4GHz/5GHz Ceramic SMT Product Specification 11 of 11 CREATED / REVISED BY: CHECKED BY: APPROVED BY: Cooper Zhou2018/12/20 Yuxi Gao 2018/12/20 Stary Song 2018/12/20 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).
