Datasheet
2.4 and 2.4, 5 GHz Ceramic
and MID Chip Antennas
2.4 and 2.4, 5 GHz Ceramic and LDS-MID antennas offer outstanding performance
and easy integration in connected city and home applications
Features and Advantages
Product and Technical Differences
Attribute
2.4, 5 GHz Ceramic SMT Antenna
(Series 211964)
2.4, 5 GHz SMT MID Chip Antenna
(Series 146175)
2.4 GHz SMT MID Chip Antenna
(Series 47948)
2.4 GHz SMT Ceramic Antenna
(Series 206513)
2.4/5GHz SMT Ceramic Antenna
(Series 206514)
Size 3.20(L) by 1.60(W) by 1.20(H) mm 5.00(L) by 3.00(W) by 4.00(H) mm 3.00 by 3.00 by 4.00mm 3.00 by 3.00 by 4.00mm 3.00 by 4.00 by 4.00mm
PCB
Keep-out
6.00(L) by 4.00(W)mm 6.00(L) by 4.00(W)mm 4.00 by 4.00mm 4.00 by 4.00mm 6.60 by 4.70mm
Material Ceramic MID-LDS MID-LDS Ceramic Ceramic
Antenna
Type
Loop Loop Monopole Monopole Monopole
Frequency
Range
2.4 to 5 GHz
2.4 to
5 GHz
5.15 to
5.85 GHz
2.4 GHz 5 GHz 2.4 to 2.5 GHz 2.4 GHz
2.4 to
2.5 GHz
5.15 to
5.85 GHz
Return Loss <-6 dB <-5 dB <-5 dB <-6 dB <-7 dB <-6 dB <-8 dB <-5 dB
Peak Gain 2.7dBi 2.1dBi 2.2dBi 3 dBi 4.2 dBi 3.3 dBi 3.0 dBi 3.5 dBi 6.2 dBi
Total
Efficiency
>80% >70% >65% 70% for both 2.4 and 5 GHz >70% >55% >75%
Polarization Linear Linear Linear Linear Linear
Operating
Temperature
-40 to +85°C -40 to +125°C -40 to +125°C -40 to +125°C -40 to +85°C
Key
Advantages
Single band and dual band. High
operating efficiency
Small clearance zone; high
RF performance; dual-band;
halogen-free
Miniature in size but big in RF
performance
Miniature and identical in size
with series 47948
High efficiency over 75% on 2.4
to 2.5GHz and 5.15 to 5.85GHz
Symmetrical radiator design offers
significant design flexibility by allowing
reversed lateral placement on the PCB
without affecting radiation pattern or
performance
Laser Direct Structuring (LDS)-
formed circuitry yields high,
consistent RF performance,
leveraging the excellent laser
structuring precision, speed,
accuracy and repeatability of LDS
technology
Environmentally sustainable
halogen-free LDS-MID housing
withstands high reflow
temperatures during assembly
processing
Cost-economical Cost-economical