Data Sheet
2016-02-29 6
Version 1.3 SFH 3710
Recommended Solder Pad
Dimensions in mm.
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
OHFP2578
3.2
1.25
1
Component location on pad
Bauteil positioniert
0
0
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L