Data Sheet
Table Of Contents
- General Description
- Pin Assignment
- Environmental Specifications
- Electrical Characteristics
- Detailed Description
- Application Information
- Mechanical Information
- Soldering Information
- Ordering & Contact Information
- RoHS Compliant & ams Green Statement
- Copyrights & Disclaimer
- Document Status
- Revision Information
- Content Guide
Page 18 ams Datasheet
Document Feedback [v1-01] 2015-Oct-12
AS-MLV-P2 − Soldering Information
Handling
The AS-MLV-P2 should be handled carefully, shear stress should
be avoided. The sensor is protected against particles and liquids
by a membrane. This membrane shall not be removed or
touched.
Soldering Instructions
The AS-MLV-P2 can be soldered in standard reflow soldering
ovens. The reflow oven shall be purged with clean air. Other
gases must be avoided. For the lead free reflow process a
standard process IPC/JEDEC J-STD-020 with peak temperature
up to maximum 230°C on surface is suggested. See Figure 19
for more detailed description.
Note(s): The device shall be kept clear of liquids; therefore a
PCB washing process must be avoided in any case.
For manual soldering: contact must be limited to 5 seconds at
a maximum temperature of 350°C.
Figure 19:
Solder Reflow Graph
Soldering Information