Data Sheet

Hall Effect Linear Current Sensor with Overcurrent
Fault Output for < 100 V Isolation Applications
ACS711
15
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Package EX, 12-Contact QFN
With Fused Sensed Current Loop
0.30
Branded Face
1.00
1
12
0.50
0.70
0.85
1.27
MIN
0.80
MIN
2.90
2.05 REF
2.70
C
C
SEATING
PLANE
0.25
+0.05
–0.07
0.40±0.10
0.50 BSC
0.75 ±0.05
3.00 BSC
3.00 BSC
D
D
Coplanarity includes exposed current path and terminals
B
A
Terminal #1 mark area
B
Fused sensed current path
For reference only, not for tooling use (reference JEDEC MO-220WEED
except for fused current path)
Dimensions in millimeters
Exact case and lead configuration at supplier discretion within limits shown
C
Reference land pattern layout (reference IPC7351
QFN50P300X300X80-17W4M);
All pads a minimum of 0.20 mm from all adjacent pads; adjust as
necessary to meet application process requirements and PCB layout
tolerances; when mounting on a multilayer PCB, thermal vias at the
exposed thermal pad land can improve thermal dissipation (reference
EIA/JEDEC Standard JESD51-5)
12
0.20
1.79
2
1
A
12
1
2
PCB Layout Reference View
C0.08
9X
Branding scale and appearance at supplier discretion
E
E
Standard Branding Reference View
N = Device part number
Y = Last two digits of year of manufacture
W = Week of manufacture
L
= Lot number
NNNN
YYWW
LLLL
1