Data Sheet

Hall Effect Linear Current Sensor with Overcurrent
Fault Output for < 100 V Isolation Applications
ACS711
13
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Application Information
Layout
Tooptimizethermalandelectricalperformance,the
followingfeaturesshouldbeincludedintheprinted
circuitboard:
•Theprimaryleadsshouldbeconnectedtoasmuch
copperareaasisavailable.
•Thecoppershouldbe2oz.orheavier.
•Additionallayersoftheboardshouldbeusedfor
conductingtheprimarycurrentifpossible,and
shouldbeconnectedusingthearrangementofvias
shownbelow.
•Thetwosolderpadsattheendsoftheexposedpad
loopshouldbeplaceddirectlyonthecoppertrace
thatconductstheprimarycurrent.
•Whenusingviasunderexposedpads,suchaswith
theEXpackage,usingpluggedviaspreventswicking
ofthesolderfromthepadintotheviaduringreflow.
Whetherornottousepluggedviasshouldbeevalu-
atedintheapplication.
Primary Current Trace
Via
Solder pads
Via under pad
Signal traces
Exposed pad loop
EX package
footprint
Primary Current Trace
Suggested Layout. EX package shown.