Specifications

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Basic Models, High-performance Models

A mode model

Operation mode

CPU type

Programming language

Program standardization and

conversion into components

I/O control

Number of I/O device points

(Note 1)

Number of I/O points

(Note 2)

Program capacity (step)

Extended file register R (points)

Pointer, nesting (points)

Constant handled

Communication port

Max. number of I/O slots

Ladder/list

Label, FB (soon to be supported)

2048 points

160ns

560ns

2.0

Refresh

No delay time

Basic model High performance model

Pointer P: 300, interrupt pointer I: 128, nesting N: 15

16-bit integer, 32-bit integer

RS-232:115.2kbps (Max.)

Q00JCPU

256 points

200ns

700ns

1.6

Q00CPU Q01CPU

14k

100ns

350ns

2.7

Max. 1018k points (memory card required) (Note 5)

Pointer P: 4096, interrupt pointer I: 256, nesting N: 15

16-bit integer, 32-bit integer, single-precision real number, character string

Q02CPU

79ns

237ns

1.8

4.4

Q02HCPU Q06CPU

Ladder/list/SFC

Label, FB

8192 points

4096 points

60k

Q12HCPU

124k

Q25HCPU

252k

LD instruction

MOV instruction

Floating-point addition

Index qualification

PC MIX value

Bit device (points)

Timer/counter (points)

Word device (points)

1024 points

16 24

28k

34ns

102ns

782ns

10.3

RS-232:115.2kbps (Max.), USB:12Mbps

Processing

speed

Data memory

Internal relay M: 8k Link relay B: 2k Special relay SM: 1k

Latch relay L: 2k Edge relay V: 1k Special link relay SB: 1k

Annunciator F: 1k

Internal relay M: 8k Link relay B: 8k Special relay SM: 2k

Latch relay L: 8k Edge relay V: 2k Special link relay SB: 2k

Step relay S: 8k Annunciator F: 2k

Timer (low/high speed) T: 512k (Low/high speed measuring

increments are set in parameters) Retentive timer ST: 0k

Counter C: 512

Timer (low/high speed) T: 2k (Low/high speed measuring

increments are set in parameters) Retentive timer ST: 0k

Counter C: 1k

Data register D: 12k File register (built-in) R: 128k (Note 4)

Link register W: 8k Special register SD: 2k

Index register Z: 16 Special link register SW: 2k

Data register D: 11136 Link register W: 2k

Special register SD: 1k Special link register SW: 1k

Index register Z: 10

File register (built-in) R: 32k (Note 3)

Note 1: Total number of I/O points on basic and extension bases directly controlled from a CPU module and I/O points controlled as remote I/O by a remote I/O network

Note 2: Number of I/O points on basic and extension bases directly controlled from a CPU module

Note 3: None for Q00JCPU, 32k for Q00/Q01CPU

Note 4: 32k for Q02CPU, 64k for Q02H/Q06HCPU, 128k for Q12H/Q25HCPU

Note 5: SRAM card: 1017k for Q2MEM-2MBS, 505k for Q2MEM-1MBS, Flash card: 1018k for Q2MEM-4MBF, 1017k for Q2MEM-2MBF

*The number of points of each device in the Q mode data memory can be changed as desired within the range of 16k words for the Q00J/Q00/Q01CPU or 29k words for the

Q02/Q02H/Q06H/Q12H/Q25HCPU.

Operation mode

CPU type

Programming language

I/O control

Number of I/O device points (Note 6)

Number of I/O points

(Note 7)

Program capacity (step)

Extended file R

Pointer, nesting

Constant handled

Communication port

Max. number of I/O slots

A mode

Q02HCPU-A

Ladder/list/SFC

Refresh

8192 points

4096 points

Internal/latch relay M/L: 8k Link relay B: 8k Annunciator F: 2k Special relay M: 256k

mer (low speed 100ms, high speed 10ms, retentive 100ms) T: 2k Coun

ter C: 1k

34ns

204ns

108µs

5.6

Max. 64k points (built-in) + 152k points (memory card required)

Pointer P: 256, interrupt pointer I: 32, nesting N: 8

6-bit integer, 32-bit integer

RS-232:115.2kbps (Max.)

Q02CPU-A

79ns

474ns

250µs

2.6

Q06HCPU-A

30k 2

Data register D: 8k Link register W: 8k Index register Z/V: 14

File register R: 8k Accumulator A: 2 Special register D: 256

LD instruction

MOV instruction

Floating-point addition

PC MIX value

Bit device (points)

Timer/counter (points)

Word device (points)

28k

Processing

speed

Data memory

Note 6: Total number of I/O points on basic and extension bases directly controlled from a CPU module and I/O points controlled as remote I/O by a remote I/O network

Note 7: Number of I/O points on basic and extension bases directly controlled from a CPU module

Item Specifications

0~55˚C

(Note 8)

-25 to 75˚C (Note 8) (Note 9)

IEC(EN)61131-2 Level RH-2 (5 to 95%RH: non-condensing) (Note 10)

Conforming to

IEC 61131-2

Operating ambient temperature

Storage ambient temperature

Operating ambient humidity

Storage ambient humidity

Vibration resistance

Shock resistance

Operating atmosphere

Operating altitude

Installation location

Overvoltage category

(Note 1)

Pollution level (Note 2)

Conforming to IEC(EN)61131-2 147 m/s , 3 times in each of 3 directions X, Y, Z

No corrosive gases

IEC(EN)61131-2 2000m max. (Note 11)

Inside control box

IEC(EN)61131-2 Category II or less

(Note 12)

IEC(EN)61131-2 Pollution level 2 or less. (Note 13)

Under intermittent vibration

Frequency

10~57Hz

57~150Hz

Under continuous vibration

Frequency

10~57Hz

57~150Hz

Sweep count

10 times each in

X, Y, Z directions

(for 80 min.)

Acceleration

9.8m/s

Acceleration

4.9m/s

Amplitude

0.075mm

Amplitude

0.035mm

Note 8: The operating/storage ambient temperature satisfies the requirements beyond the requirements in IEC(EN)61131-2.

Note 9: When used with the AnS series modules, the Q series PLC should be stored at -20 to 75˚C.

Note 10: When used with the AnS series modules, the Q series PLC should be operated within 10 to 90%RH.

Note 11: The PLC cannot be used under pressure higher than the atmospheric pressure of altitude 0m. Doing so can cause a failure.

Note 12: This indicates the section of the power supply to which the equipment is assumed to be connected between the public electrical power distribution

network and the machinery within premises. Category II applies to equipment for which electrical power is supplied from fixed facilities. The surge

voltage withstand level for up to the rated voltage of 300 V is 2500 V.

Note 13: This index indicates the degree to which conductive material is generated in the environment where the equipment is used. In pollution level 2, only

non-conductive pollution occurs but temporary conductivity may be produced due to condensing.

General specifications indicate the environmental specifications in which this product can be installed and operated. Unless otherwise

specified, the general specifications apply to all products of the Q series. Install and operate the Q series products in the environment

indicated in the general specifications.

GERERAL SPECIFICATIONS

CPU MODULE PERFORMANCE SPECIFICATIONS