Specifications

Dec. 20

Mitsubishi IPM-series Application Note

Index

1. IPM L-series Features

2. Product Line-up

3. Term Explanation

4. Numbering System

5. Structure

6. Correct and Safety Use of Power Module

7. Reliability

7-1. Introduction

7-2. Basic Concepts of Semiconductor Device Reliability

7-3. Mitsubishi’s Quality-Assurance Program

7-4. Reliability Testing

7-5. Failure Analysis

7-6. Derating and Reliability Projections

7-7. Conclusion

8. Installation of power Module

8-1. Installing Capacitor

8-2. Installation Hints

8-3. Thermal Impedance Considerations & Chip Layout

8-4. Coating Method of Thermal Grease (Example)

9. Using IPM

9-1. Applications of IPM L-series

9-2. Interface of control side of IPM

9-3. Control Power supply of IPM

9-4. Fault Signal of IPM

9-5. Other notice of using IPM

10. Power Loss and Junction Temperature

11. Average Power Loss Simplified Calculation

12. Notice for safe Designs and when Using This Specification