Specifications

19
Dec. 20
Mitsubishi IPM-series Application Note
8-3 Thermal Impedance Considerations & Chip Layout
The junction to case thermal resistance R
th(j-c)
and the case to heat-sink thermal resistance R
th(c-f)
are given in datasheet.
The case temperature has been measured at the just under the chip.
The case temperature measurement point of various products is shown in Table 3. It is measured by uniform 100μm~200μm
coating of thermal grease with thermal conductivity of 0.92W/m㨯°C between the module and heat-sink. A Thermo-couple is
used to measure the temperature of case and heat-sink at the same point shown in the following tables. (0.8φ 3mm depth,
0.3φ thermo-couple)
㨯Note
*The thermal impedance depends on the material, area and thickness of heat-sink. The smaller the area and the thinner the
heat-sink is, the lower the impedance is for the same material.
*The type and quantity of thermal compounds can affect the thermal resistance.
Table 3:Thermal resistance and chip layout of IPM L-series
㪫㪿㪼㫉㫄㪸㫃㩷㫉㪼㫊㫀㫊㫋㪸㫅㪺㪼㩷㪍㪇㪇㪭㩷㫋㫐㫇㪼㩷
㩷 㪠㫅㫍㪼㫉㫋㪼㫉㩷 㪚㫆㫅㫍㪼㫉㫋㪼㫉㩷
㪡㫌㫊㫋㩷㫌㫅㪻㪼㫉㩷㫋㪿㪼㩷㪺㪿㫀㫇㩷 㪡㫌㫊㫋㩷㫌㫅㪻㪼㫉㩷㫋㪿㪼㩷㪺㪿㫀㫇㩷
㪺㫆㫅㫋㪸㪺㫋㩷㫋㪿㪼㫉㫄㪸㫃㩷
㫉㪼㫊㫀㫊㫋㪸㫅㪺㪼㩷
㪫㫐㫇㪼㩷㪥㪸㫄㪼㩷
㪠㪞㪙㪫㪄㪺㪿㫀㫇㩷
㪩㫋㪿㩿㫁㪄㪺㪀㪨㩷
㪝㪮㪛㫀㪄㪺㪿㫀㫇㩷
㪩㫋㪿㩿㫁㪄㪺㪀㩷
㪠㪞㪙㪫㪄㪺㪿㫀㫇㩷
㪩㫋㪿㩿㫁㪄㪺㪀㪨㩷
㪝㪮㪛㫀㩿㪧㪀㪄㪺㪿㫀㫇
㩷
㪩㫋㪿㩿㫁㪄㪺㪀㩷
㩷
㪩㫋㪿㩿㪺㪄㪽㪀㩷
㪧㪤㪌㪇㪩㪣㪘㪆㪙㪇㪍㪇㪃㪧㪤㪌㪇㪚㪣㪘㪆㪙㪇㪍㪇㩷 㪇㪅㪐㪌㩷 㪈㪅㪍㪈㩷 㪈㪅㪉㪈㩷 㪉㪅㪈㪐㩷 㪇㪅㪇㪊㪏㩷
㪧㪤㪎㪌㪩㪣㪘㪆㪙㪇㪍㪇㪃㪧㪤㪎㪌㪚㪣㪘㪆㪙㪇㪍㪇㩷 㪇㪅㪊㪉㩷 㪇㪅㪌㪊㩷 㪇㪅㪋㪉㩷 㪇㪅㪎㪈㩷 㪇㪅㪇㪊㪏㩷
㪧㪤㪈㪇㪇㪩㪣㪘㪆㪙㪇㪍㪇㪃㪧㪤㪈㪇㪇㪚㪣㪘㪆㪙㪇㪍㪇㩷 㪇㪅㪉㪎㩷 㪇㪅㪋㪊㩷 㪇㪅㪋㪉㩷 㪇㪅㪎㪈㩷 㪇㪅㪇㪊㪏㩷
㪧㪤㪈㪌㪇㪩㪣㪘㪆㪙㪇㪍㪇㪃㪧㪤㪈㪌㪇㪚㪣㪘㪆㪙㪇㪍㪇㩷 㪇㪅㪉㪇㩷 㪇㪅㪊㪊㩷 㪇㪅㪊㪉㩷 㪇㪅㪌㪊㩷 㪇㪅㪇㪊㪏㩷
㪧㪤㪉㪇㪇㪩㪣㪘㪆㪚㪣㪘㪇㪍㪇㩷 㪇㪅㪈㪍㩷 㪇㪅㪉㪌㩷 㪇㪅㪉㪏㩷 㪇㪅㪋㪋㩷 㪇㪅㪇㪉㪊㩷
㪧㪤㪊㪇㪇㪩㪣㪘㪆㪚㪣㪘㪇㪍㪇㩷 㪇㪅㪈㪉㩷 㪇㪅㪈㪐㩷 㪇㪅㪉㪈㩷 㪇㪅㪊㪋㩷 㪇㪅㪇㪉㪊㩷
㪧㪤㪋㪌㪇㪚㪣㪘㪇㪍㪇㩷 㪇㪅㪈㪉㩷 㪇㪅㪈㪐㩷 㪄㩷 㪄㩷 㪇㪅㪇㪈㪋㩷
㪧㪤㪍㪇㪇㪚㪣㪘㪇㪍㪇㩷 㪇㪅㪇㪎㩷 㪇㪅㪈㪈㩷 㪄㩷 㪄㩷 㪇㪅㪇㪈㪋㩷
㪫㪿㪼㫉㫄㪸㫃㩷㫉㪼㫊㫀㫊㫋㪸㫅㪺㪼㩷㪈㪉㪇㪇㪭㩷㫋㫐㫇㪼㩷
㩷 㪠㫅㫍㪼㫉㫋㪼㫉㩷 㪚㫆㫅㫍㪼㫉㫋㪼㫉㩷
㪡㫌㫊㫋㩷㫌㫅㪻㪼㫉㩷㫋㪿㪼㩷㪺㪿㫀㫇㩷 㪡㫌㫊㫋㩷㫌㫅㪻㪼㫉㩷㫋㪿㪼㩷㪺㪿㫀㫇㩷
㪺㫆㫅㫋㪸㪺㫋㩷㫋㪿㪼㫉㫄㪸㫃㩷
㫉㪼㫊㫀㫊㫋㪸㫅㪺㪼㩷
㪫㫐㫇㪼㩷㪥㪸㫄㪼㩷
㪠㪞㪙㪫㪄㪺㪿㫀㫇㩷
㪩㫋㪿㩿㫁㪄㪺㪀㪨㩷
㪝㪮㪛㫀㪄㪺㪿㫀㫇㩷
㪩㫋㪿㩿㫁㪄㪺㪀㩷
㪠㪞㪙㪫㪄㪺㪿㫀㫇㩷
㪩㫋㪿㩿㫁㪄㪺㪀㪨㩷
㪝㪮㪛㫀㩿㪧㪀㪄㪺㪿㫀㫇
㩷
㪩㫋㪿㩿㫁㪄㪺㪀㩷
㩷
㪩㫋㪿㩿㪺㪄㪽㪀㩷
㪧㪤㪉㪌㪩㪣㪘㪆㪙㪈㪉㪇㪃㪧㪤㪉㪌㪚㪣㪘㪆㪙㪈㪉㪇㩷 㪇㪅㪏㪊㩷 㪈㪅㪊㪍㩷 㪇㪅㪐㪍㩷 㪈㪅㪏㪉㩷 㪇㪅㪇㪊㪏㩷
㪧㪤㪌㪇㪩㪣㪘㪆㪙㪈㪉㪇㪃㪧㪤㪌㪇㪚㪣㪘㪆㪙㪈㪉㪇㩷 㪇㪅㪉㪍㩷 㪇㪅㪊㪐㩷 㪇㪅㪊㪍㩷 㪇㪅㪍㪇㩷 㪇㪅㪇㪊㪏㩷
㪧㪤㪎㪌㪩㪣㪘㪆㪙㪈㪉㪇㪃㪧㪤㪎㪌㪚㪣㪘㪆㪙㪈㪉㪇㩷 㪇㪅㪉㪈㩷 㪇㪅㪊㪇㩷 㪇㪅㪉㪏㩷 㪇㪅㪋㪌㩷 㪇㪅㪇㪊㪏㩷
㪧㪤㪈㪇㪇㪩㪣㪘㪈㪉㪇㪃㪧㪤㪈㪇㪇㪚㪣㪘㪈㪉㪇㩷 㪇㪅㪈㪍㩷 㪇㪅㪉㪍㩷 㪇㪅㪉㪍㩷 㪇㪅㪋㪇㩷 㪇㪅㪇㪉㪊㩷
㪧㪤㪈㪌㪇㪩㪣㪘㪈㪉㪇㪃㪧㪤㪈㪌㪇㪚㪣㪘㪈㪉㪇㩷 㪇㪅㪈㪉㩷 㪇㪅㪉㪇㩷 㪇㪅㪉㪈㩷 㪇㪅㪊㪈㩷 㪇㪅㪇㪉㪊㩷
㪧㪤㪉㪇㪇㪚㪣㪘㪈㪉㪇㩷 㪇㪅㪈㪉㩷 㪇㪅㪉㪇㩷 㪄㩷 㪄㩷 㪇㪅㪇㪈㪋㩷
㪧㪤㪊㪇㪇㪚㪣㪘㪈㪉㪇㩷 㪇㪅㪇㪏㩷 㪇㪅㪈㪊㩷 㪄㩷 㪄㩷 㪇㪅㪇㪈㪋㩷
㪧㪤㪋㪌㪇㪚㪣㪘㪈㪉㪇㩷 㪇㪅㪇㪌㩷 㪇㪅㪇㪐㩷 㪄㩷 㪄㩷 㪇㪅㪇㪈㪋㩷
㩷
Heat-sink
Base plate
Processes a ditch
㪫㪿㪼㫉㫄㫆㩷㪺㫆㫌㫇㫃㪼㩷
㪙㩷
㪫㪽
㪫㪿㪼㫉㫄㫆㩷㪺㫆㫌㫇㫃㪼㩷㪘㩷
㪫㪺㩿㫁㫌㫊㫋㩷㫌㫅㪻㪼㫉㩷㫋㪿㪼㩷㪺㪿㫀㫇㪀
Chip
Installation of power Module