Specifications

Chapter 1: Mitel 5000 v3.0 New Features
Increased DEI Capacity
Mitel
®
5000 Installation Manual – Issue 3.0, October 2008 Page 1-3
Increased DEI Capacity
This release supports an additional 96 digital endpoints on two DEIs for a total digital endpoint
capacity of 192 (12 DEMs in four DEI chassis). The IP and digital endpoint capacity for the CS-
5200/5400 remain approximately the same as pre-v3.0 given the trade-off occurred when
increasing digital capacity; IP endpoint capacity will decrease. See Tab le 1-1 for capacity
information. Hardware requirements for the additional DEIs include:
• The additional third or fourth DEI chassis.
• Additional expansion modules (DEMs or SLM8s) for the new DEIs.
• Additional cabling (for example AIC, power, endpoint cables).
Mitel Cordless Devices
Version 3.0 supports the Mitel cordless handset and headset for the Mitel Models 5330 and
5340 IP endpoints. Both cordless devices connect to the Mitel IP endpoints through the cordless
module, which attaches to the back of the endpoint. The cordless headset recharges in a
headset cradle that attaches to the side of the endpoint. The cordless handset recharges in the
handset cradle.
NOTICE
The Mitel 5000 v3.0 release requires a minimum 512MB compact flash-type memory card. If
the system is currently using a 256MB compact flash-type memory card, upgrade the card to
either 512MB (part number 841.0274) or 1024MB (part number 841.0273) before upgrading
the system to v3.0.
Table 1-1. Expanded DEI Capacity
System DEIs
Maximum IP
Endpoints
Total
Endpoints
Comments
CS-5200 2 75 171 Current capacity
(maximum 3 DEIs
on 5200)
3 25 169
CS-5400 2 175 271 Current capacity
3 125 269
4 75 267
CS-5600 2 250 346 Current capacity
3 250 394
4 250 442
NOTE
Installation instructions are included with each device. However, when installing a
cordless device, press and hold the Module Pairing button on the back of the
cordless module for about 5–15 seconds. Then follow the “Hookswitch” instructions
shown on the endpoint display to pair the cordless device with the module. See the
installation instructions included with the device for Module Pairing button and
Hookswitch button locations.