Data Sheet

FMLR-6X-P-MA62X
9/13
Recommended Solder-
ing Conditions
The following graph shows a typical temperature profile for the module soldering process. The
exact values to be used in production is highly depending on other parameters of the soldering
process, such as soldering paste, PCB design, soldering process, etc.
Reflow process should be finished within 1 cycle.
Figure 4: Soldering Profile
SOLDERING CONDITIONS
Step (see Figure 4: Soldering Profile) Temperature Time
Preheat (T
PH
, t
PH
) 150 to 180 °C 120 s
Heating (T
1
, t
1
) 220 °C 60 s
Reflow (T
2
, t
2
) 255 °C 5 s