Specifications

Draper Prison Wasatch & Oquirrh Intercom & Paging System Remodel 4-21-2014
GROUNDING AND BONDING FOR COMMUNICATIONS SYSTEMS 270526 - 6
3.5 CONNECTIONS
A. Bond metallic equipment in a telecommunications equipment room to the grounding busbar in
that room, using equipment grounding conductors not smaller than No. 6 AWG.
B. Stacking of conductors under a single bolt is not permitted when connecting to busbars.
C. Assemble the wire connector to the conductor, complying with manufacturer's written
instructions and as follows:
1. Use crimping tool and the die specific to the connector.
2. Pretwist the conductor.
3. Apply an antioxidant compound to all bolted and compression connections.
D. Primary Protector: Bond to the TMGB with insulated bonding conductor.
E. Interconnections: Interconnect all TGBs with the TMGB with the telecommunications backbone
conductor. If more than one TMGB is installed, interconnect TMGBs using the grounding
equalizer conductor. The telecommunications backbone conductor and grounding equalizer
conductor size shall not be less than 2 kcmils/linear foot (1 sq. mm/linear meter) of conductor
length, up to a maximum size of No. 3/0 AWG [168 kcmils (85 sq. mm)] unless otherwise
indicated.
F. Telecommunications Enclosures and Equipment Racks: Bond metallic components of
enclosures to the telecommunications bonding and grounding system. Install [top-mounted]
[vertically mounted] rack grounding busbar unless the enclosure and rack are manufactured
with the busbar. Bond the equipment grounding busbar to the TGB No. 2 AWG bonding
conductors.
G. Structural Steel: Where the structural steel of a steel frame building is readily accessible within
the room or space, bond each TGB and TMGB to the vertical steel of the building frame.
H. Electrical Power Panelboards: Where an electrical panelboard for telecommunications
equipment is located in the same room or space, bond each TGB to the ground bar of the
panelboard.
I. Shielded Cable: Bond the shield of shielded cable to the TGB in communications rooms and
spaces. Comply with TIA/EIA-568-B.1 and TIA/EIA-568-B.2 when grounding screened,
balanced, twisted-pair cables.
J. Rack- and Cabinet-Mounted Equipment: Bond powered equipment chassis to the cabinet or
rack grounding bar. Power connection shall comply with NFPA 70; the equipment grounding
conductor in the power cord of cord- and plug-connected equipment shall be considered as a
supplement to bonding requirements in this Section.
K. Access Floors: Bond all metal parts of access floors to the TGB.
L. Equipment Room Signal Reference Grid: Provide a low-impedance path between
telecommunications cabinets, equipment racks, and the reference grid, using No. 6 AWG
bonding conductors.
Bid DA14027DFCM
5/30/2014 2:08 PM p. 96