Datasheet

 2004 Microchip Technology Inc. DS39609B-page 359
PIC18F6520/8520/6620/8620/6720/8720
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-092
1.101.00.043.039
1.140.890.64.045.035.025CHPin 1 Corner Chamfer
1.00.039
(F)
Footprint (Reference)
(F)
E
E1
#leads=n1
p
B
D1
D
n
1
2
φ
c
β
L
A
A1
A2
α
Units INCHES MILLIMETERS*
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins
n
80 80
Pitch
p
.020 0.50
Overall Height A .047 1.20
Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05
Standoff § A1 .002 .004 .006 0.05 0.10 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Foot Angle
φ
03.5 7 03.5 7
Overall Width E .541 .551 .561 13.75 14.00 14.25
Overall Length D .541 .551 .561 13.75 14.00 14.25
Molded Package Width E1 .463 .472 .482 11.75 12.00 12.25
Molded Package Length D1 .463 .472 .482 11.75 12.00 12.25
Pins per Side n1 20 20
Lead Thickness
c
.004 .006 .008 0.09 0.15 0.20
Lead Width B .007 .009 .011 0.17 0.22 0.27
Mold Draft Angle Top
α
5 10 15 5 10 15
Mold Draft Angle Bottom
β
5 10 15 5 10 15
CH x 45
°
§ Significant Characteristic