Datasheet

© 2008 Microchip Technology Inc. DS39646C-page 379
PIC18F8722 FAMILY
28.2 DC Characteristics: Power-Down and Supply Current
PIC18F6X27/6X22/8X27/8X22 (Industrial, Extended)
PIC18LF6X27/6X22/8X27/8X22 (Industrial)
PIC18LF6X27/6X22/8X27/8X22
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
PIC18F6X27/6X22/8X27/8X22
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
-40°C T
A +125°C for extended
Param
No.
Device Typ Max Units Conditions
Power-Down Current (I
PD)
(1)
PIC18LF6X27/6X22/8X27/8X22 120 700 nA -40°C
V
DD = 2.0V
(Sleep mode)
120 700 nA +25°C
0.24 3.0 μA +85°C
PIC18LF6X27/6X22/8X27/8X22 120 900 nA -40°C
V
DD = 3.0V
(Sleep mode)
120 900 nA +25°C
0.36 6 μA +85°C
All devices 0.12 2 μA -40°C
V
DD = 5.0V
(Sleep mode)
0.12 2 μA +25°C
0.48 9 μA +85°C
Extended devices only 12 100 μA +125°C
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD OR VSS;
MCLR
= VDD; WDT enabled/disabled as specified.
3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0. When
operation will always be above -10°C, then the low-power Timer1 oscillator may be selected.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than
the sum of both specifications.