User Manual

2 3
click
BOARD
™
www.mikroe.com
2. Soldering the headers
3. Plugging the board in
Once you have soldered the headers your
board is ready to be placed into the desired
mikroBUS
™
socket. Make sure to align the cut in
the lower-right part of the board with the
markings on the silkscreen
at the mikroBUS
™
socket.
If all the pins are aligned
correctly, push the board all
the way into the socket.
Turn the board upward again. Make sure
to align the headers so that they are
perpendicular to the board, then solder the
pins carefully.
Turn the board upside down so that
the bottom side is facing you upwards.
Place shorter pins of the header into the
appropriate soldering pads.
Before using your click board
™
, make sure
to solder 1x8 male headers to both left and
right side of the board. Two 1x8 male headers
are included with the board in the package.
4. Essential features
The biggest asset of 3D Motion click and the
MM7150 module is the integrated motion co-
processor. This chip takes raw data from indi-
vidual sensors (accelerometer, magnetometer,
and gyroscope) and then uses preprogrammed
sensor fusion algorithms to lter, compensate
and combine the data. The fusion rmware
suppress magnetic distortion, cancels gyro-
scope drift, and performs in-use background
calibrations of all sensors. In the end you get
easy access to reliable and accurate position-
ing and orientation information.
1
3D Motion click carries Microchip’s MM7150
9-axis sensor fusion motion module. It’s a
complete self contained solution comprising a
3-axis accelerometer, a gyroscope, a magne-
tometer, and a SSC7150 motion coprocessor.
The board communicates with the target MCU
through the mikroBUS
™
I
2
C interface (SCL, SDA
— with support to speeds up to 400kHz); WAKE
and RESET pins are also used (in placed of de-
fault mikroBUS
™
AN and RST respectively), as
well as an interrupt pin (INT). It’s designed to
use a 3.3V power supply.
3D MOTION click
1. Introduction
3D MOTION click manual
ver 1.01
0100000077931