Information

PIC18F8722 FAMILY
DS39646C-page 384 © 2008 Microchip Technology Inc.
Supply Current (I
DD)
(2)
Extended devices only 10 15 mA +125°C VDD = 4.2V FOSC = 25 MHz
(PRI_RUN mode,
EC oscillator)
13 18 mA +125°C
V
DD = 5.0V
All devices 18 23.5 mA -40°C
F
OSC = 40 MHZ
(PRI_RUN mode,
EC oscillator)
19 23.5 mA +25°C V
DD = 4.2V
19 23.5 mA +85°C
All devices 25 29 mA -40°C
25 29 mA +25°C V
DD = 5.0V
25 29 mA +85°C
28.2 DC Characteristics: Power-Down and Supply Current
PIC18F6X27/6X22/8X27/8X22 (Industrial, Extended)
PIC18LF6X27/6X22/8X27/8X22 (Industrial) (Continued)
PIC18LF6X27/6X22/8X27/8X22
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18F6X27/6X22/8X27/8X22
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
-40°C ≤ T
A ≤ +125°C for extended
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD OR VSS;
MCLR
= VDD; WDT enabled/disabled as specified.
3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0. When
operation will always be above -10°C, then the low-power Timer1 oscillator may be selected.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than
the sum of both specifications.