Information

PIC18F8722 FAMILY
DS39646C-page 380 © 2008 Microchip Technology Inc.
Supply Current (I
DD)
(2)
PIC18LF6X27/6X22/8X27/8X22 18 25 μA-40°C
F
OSC = 31 kHz
(RC_RUN mode,
Internal oscillator source)
18 22 μA +25°C V
DD = 2.0V
18 25 μA +85°C
PIC18LF6X27/6X22/8X27/8X22 48 70 μA-40°C
42 50 μA +25°C V
DD = 3.0V
36 47 μA +85°C
All devices 126 180 μA-40°C
V
DD = 5.0V
108 150 μA +25°C
96 140 μA +85°C
Extended devices only 96 230 μA +125°C
PIC18LF6X27/6X22/8X27/8X22 380 440 μA-40°C
F
OSC = 1 MHz
(RC_RUN mode,
Internal oscillator source)
380 440 μA +25°C V
DD = 2.0V
380 440 μA +85°C
PIC18LF6X27/6X22/8X27/8X22 720 800 μA-40°C
700 740 μA +25°C V
DD = 3.0V
720 740 μA +85°C
All devices 1.2 1.4 mA -40°C
V
DD = 5.0V
1.2 1.3 mA +25°C
1.2 1.3 mA +85°C
Extended devices only 1.2 1.4 mA +125°C
28.2 DC Characteristics: Power-Down and Supply Current
PIC18F6X27/6X22/8X27/8X22 (Industrial, Extended)
PIC18LF6X27/6X22/8X27/8X22 (Industrial) (Continued)
PIC18LF6X27/6X22/8X27/8X22
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18F6X27/6X22/8X27/8X22
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
-40°C ≤ T
A ≤ +125°C for extended
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD OR VSS;
MCLR
= VDD; WDT enabled/disabled as specified.
3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0. When
operation will always be above -10°C, then the low-power Timer1 oscillator may be selected.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than
the sum of both specifications.