Datasheet

1. Introduction
2 3
4. Essential features
ver. 1.00
0 100000 026823
BLE P click
™
manual
click
™
BOARD
www.mikroe.com
3. Plugging the board in
2. Soldering the headers
Once you have soldered the headers your
board is ready to be placed into the desired
mikroBUS
™
socket. Make sure to align the
cut in the lower-right part of the board with
the markings on the silkscreen at the
mikroBUS
™
socket. If all the pins
are aligned correctly, push the
board all the way into the socket.
Turn the board upward again. Make sure
to align the headers so that they are
perpendicular to the board, then solder
the pins carefully.
Turn the board upside down so that
the bottom side is facing you upwards.
Place shorter pins of the header into the
appropriate soldering pads.
Before using your click
™
board, make sure
to solder 1x8 male headers to both left
and right side of the board. Two 1x8 male
headers are included with the board in
the package.
BLE P click
™
1
BLE P click
™
is a simple solution for adding
a Bluetooth 4.0 (alternatively known as
Bluetooth Low Energy) peripheral device
to your design. It communicates with the
target board through mikroBUS
™
SPI (CS,
SCK, MISO, MOSI), INT (RDY) and AN (ACT)
lines. Beside the mikroBUS
™
socket, BLE P
click
™
also features additional UART input
and output pins (RXD and TXD). These
enable you to test the RF parameters of
the BLE P’s radio design. The board uses a
3.3V power supply only.
BLE P click
™
carries a nRF8001 single-chip
Bluetooth low energy IC. Compared to its
predecesors, Bluetooth 4.0 has reduced
power consumption while keeping a similar
range. nRF8001 click
™
has a built-in stack
that features a low energy PHY layer, low
energy link layer slave, low energy host
for devices in the peripheral role and an
Application Controller Interface. Applications
for BLE P include Sport and tness sensors,
Health care sensors, proximity sensors,
smart watches, Personal User Interface
Devices and remote controls.