Datasheet

10.1.1
FPC
FPC;
FPC
18
10. Precautions for Use of LCD Modules
10.1 Handling Precautions
The display panel is made of glass. Do not subject it to a mechanical shock
16
defect
Component soldering:
No cold soldering、short、open circuit、
burr、tin ball
The flat encapsulation component
position deviation must be less than 1/3
width of the pin (Pic.1)；
the sheet component deviation:
Pin deviates from the pad and contact
with the near components is not
permitted（Pic.2）
lead defect:
The lead lack must be less than 1/3 of its
width;
The lead burr must be less than 1/3 of
the seam;
Impurities connect with the near leads is
not permitted
Connector soldering:
Soldering tin is at contact position of the
plug and socket is not permitted
No foundation is scald
Serious cave distortion on plug and
socket contact pin is not permitted
Glue on root of the speaker receiver and
motor lead:
The insulative coat of the lead must join
into the the protected glue must
envelop to the insulative coat.
WL≤W/2
Component
Soldering pad
Component
Lead
L1>0
L2>0
Soldering tin is not permit in this area
Base Boardhead
socket
Soldering tin is not permit in this area
Base Board
Lead
Insulative coat
Glue
A-TOPS ELECTRONICS COMPANY